Vacuum generating device of wafer chuck
A technology of vacuum generating device and vacuum generator, which is applied in the manufacture of electrical components, semiconductor/solid state devices, circuits, etc., can solve the problems of waste of compressed air and increase of production cost, so as to improve economic benefits, save production costs, and save compression air effect
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- Publication Date
- 2014-01-22
- Estimated Expiration
- Not applicable · inactive patent
Smart Images
Figure 1
Abstract
Description
technical field
[0001] The invention relates to a vacuum generator, in particular to a vacuum generator for a wafer chuck. Background technique
[0002] In the prior art, the wafer chuck grabs the wafer through vacuum suction, and the vacuum is formed by jetting compressed air. However, generally speaking, the jetted compressed air is always in a conveying state, but the wafer chuck does not It will always be in working condition, that is, it does not always need to generate vacuum suction, but only needs vacuum suction when grabbing the wafer. Therefore, the long-open compressed air is wasted most of the time, which increases the production cost. Contents of the invention
[0003] The purpose of the present invention is to provide a vacuum generating device for a wafer chuck, which ensures the synchronization of the wafer chuck and the vacuum generator; when the vacuum generator does not need to work, it saves a lot of compressed air, saves production costs, and improves ...
Examples
Embodiment Construction
[0010] The present invention will be further elaborated below by describing a preferred specific embodiment in detail in conjunction with the accompanying drawings.
[0011] Such as figure 1 As shown, a vacuum generating device for a wafer chuck includes: a vacuum generator 1 connected through pipelines, a compressed air pipeline 2 and a gas valve 3 . Wherein, the vacuum generator 1 provides vacuum to the wafer chuck; the gas valve 3 is arranged on the compressed air pipeline 2, and the control end of the gas valve 3 is connected to the gas supply pipeline 5 of the working valve 4 of the external wafer chuck through the pipeline.
[0012] When working, the gas supply pipeline 5 provides compressed air to the working valve 4, so that the wafer chuck starts to work, and at the same time, part of the compressed air from the gas supply pipeline 5 enters the control end of the gas valve 3, thereby leading the gas valve 3, with Input compressed air to the vacuum generator 1, and th...