Vacuum generating device of wafer chuck

Abstract

The invention discloses a vacuum generating device of a wafer chuck. The device comprises a vacuum generator and a compressed air pipeline which are connected by a pipeline, wherein the vacuum generator provides vacuum for the wafer chuck. The device further comprises an air valve which is arranged between the vacuum generator and the compressed air pipeline. A control end of the air valve is connected with a gas supply pipeline of a working valve of an external wafer chuck through a pipeline. When the gas supply pipeline supplies compressed air to the working valve, a part of the compressed air is separated to enter the control end of the air valve so that the air valve is switched on and the compressed air can be input to the vacuum generator. The wafer chuck and the vacuum generator are ensured to be synchronous; and when the vacuum generator does not need to work, a large amount of compressed air is saved, the production cost is saved, and the economic efficiency is improved.

Description

technical field [0001] The invention relates to a vacuum generator, in particular to a vacuum generator for a wafer chuck. Background technique [0002] In the prior art, the wafer chuck grabs the wafer through vacuum suction, and the vacuum is formed by jetting compressed air. However, generally speaking, the jetted compressed air is always in a conveying state, but the wafer chuck does not It will always be in working condition, that is, it does not always need to generate vacuum suction, but only needs vacuum suction when grabbing the wafer. Therefore, the long-open compressed air is wasted most of the time, which increases the production cost. Contents of the invention [0003] The purpose of the present invention is to provide a vacuum generating device for a wafer chuck, which ensures the synchronization of the wafer chuck and the vacuum generator; when the vacuum generator does not need to work, it saves a lot of compressed air, saves production costs, and improves ...

AI Technical Summary

Problems solved by technology

[0002] In the prior art, the wafer chuck grabs the wafer through vacuum suction, and the vacuum is formed by jetting compressed air. However, generally speaking, the jetted compressed air is always in a conveying state, but the wafer chuck does not It will always be in the working state, that is, it does not always need to generate vacuum suction, but only needs vacuum suction when grabbing the wafer. Therefore, the long-open compressed air is wasted most of the time, which increases production costs.

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