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Device for testing electronic component device

A technology of electronic components and equipment, which is applied in the field of equipment for testing electronic components, can solve the problems of large mechanical stress and damage of the substrate, and achieve the effect of avoiding turning torque and high clamping effect

Inactive Publication Date: 2014-02-26
马提特斯电子系统有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because the substrate is so thin, large mechanical stresses are generated within the substrate, which can lead to damage

Method used

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  • Device for testing electronic component device
  • Device for testing electronic component device
  • Device for testing electronic component device

Examples

Experimental program
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Effect test

Embodiment Construction

[0045] exist figure 1 The device shown in FIG. 2 has a ram 5 which can be run up and down uniformly by means of a screw 8 . On the indenter there is provided a pocket 6 which contains a receptacle 7 for a substrate which is not visible in this illustration and forms, together with an X-Y movement not shown here, a 9 positioning and holding devices (see image 3 ).

[0046] The substrate 9 can be positioned with high precision under the test seat 3 by means of the recess 6 . Installed on the substrate 9 in image 3 Component 10 shown in the figure.

[0047] The test head 1 is mounted on the indenter 5 and the pocket 6 as a fixed immovable module. The connection between the test head 1 and the test socket 3 is realized through the load plate 2 .

[0048] To test the component 10 , the pressing head 5 is moved upwards and the contacts on the substrate 9 are pressed against the test pins of the test receptacle 3 with great force. The component 10 is mounted on the underside...

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PUM

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Abstract

A device for testing electronic component devices mounted on a substrate, having test pins which can be placed on contact surfaces of the substrate. A frame-like support structure is provided, which supports the substrate such that the individual component devices are located in open spaces of the support structure.

Description

technical field [0001] The invention relates to a device for testing electronic components according to the preamble of claim 1 . Background technique [0002] In order to save space on circuit boards, the integration density of electronic components should be continuously increased. For this purpose, different components have recently been connected vertically and three-dimensionally on top of one another as so-called 3D-ICs. The vertical connection of the individual components is preferably realized by TSV technology (Through-Silicon-Via). In TSV technology, the connections between the individual horizontal layers are made by vertical metal connections with a diameter of approximately 5 μm. This 3D TSV-IC is highly integrated and exceptionally solidly connected with respect to its substrate. [0003] The greater rejection rate determined by the high level of integration can be minimized by not only testing the finished ICs but also testing during the stacking when new c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R1/04
CPCG01R1/0408G01R31/2886G01R31/318511H01L22/00G01R31/26
Inventor B·佩兹
Owner 马提特斯电子系统有限公司