Method for detecting corrosion of metal wiring in production environment

Abstract

The invention discloses a method for detecting metal-wire corrosion by a production environment. The method includes the following steps: providing a wafer and preparing an ion-trap combination structure on a scribe line of the wafer, wherein the ion-trap combination structure includes ion-trap structures of different kinds of device structures and a P trap and an N trap of the iron-trap structure of each device are connected with metal wires through contact holes above the P trap and the N trap; placing the wafer in which the iron-trap combination structure is prepared well in a normal production environment; and observing the electrochemical-corrosion condition of the metal wires of the iron-trap combination structure on the scribe line of the wafer through a microscope. Through the technical scheme, effects of the production environment on the corrosion of the metal wires can be detected faster so that corresponding improvement in actual production is facilitated and thus yield of the product is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a method for detecting corrosion of metal wiring in a production environment. Background technique [0002] With the continuous progress of VLSI production technology, the influence of environment on device performance in the production process is also increasing. With the continuous reduction of the line width of integrated circuits, especially in the back-stage copper metal interconnection process, electrochemical reactions may occur on the surface of the wafer within a few hours after chemical mechanical polishing. figure 1 Defects on metal shown. The generation of defects is directly related to the microenvironment of the wafer surface and the device structure under the metal wiring. At present, there are mature processes and technologies for the detection of air particles and chemical components in the clean room of integrated circuit production, but th...

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Problems solved by technology

[0007] In view of the above existing problems, the present invention discloses a method for detecting the corrosion of metal wiring in the production environment, in order to overcome the slow electrochemical corrosion of metal wiring in the existing structure in the prior art, and some may have already occurred A certain degree of electrochemical reaction cannot be found by the monitoring method of the production process. It may not be determined until the final electrical test fails, which will cause the problem of yield loss.

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