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Cleavage device

A cleavage and natural cleavage technology, which is applied in the field of cleavage devices for semiconductor materials, can solve the problems of debris contamination, debris easy to adhere to the roller, mechanical damage, etc.

Inactive Publication Date: 2014-04-16
QINGDAO RUNXIN WEIYE TECH & TRADE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method of cleavage will cause a large degree of mechanical damage to some devices whose surface structure is not pressure-resistant. At the same time, the roller directly contacts the surface of the chip,

Method used

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Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach

[0005] The cleavage method and the cleavage device of the present invention are applied to the cleavage process of brittle materials such as GaAs and InP, and can realize the purpose of non-contact splitting of the sample surface. The present invention is applicable to the cleavage of brittle materials. In order to make the present invention easier to understand, the following will describe in detail the preferred embodiments applying the technology of the present invention.

[0006] The cleaving device that the present invention relates to is a kind of pneumatic device, and this device realizes through the novel supporting member. The support is designed as a long block, and the inside is hollowed out to form a closed chamber. The side of the chamber is perforated to connect the vacuum tube. The upper surface is composed of two surfaces, the left surface is parallel to the lower surface, and the angle between the right surface and the lower surface is less than 8° , perforate...

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PUM

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Abstract

The invention provides a cleavage device. Pneumatic suction force is adopted to force a chip to naturally split in the crystal orientation. In order to realize the suction force, a sample supporting piece of a conventional cleavage table is changed into a pneumatic device and is designed into a long block. The inside of the sample supporting piece is hollowed out and forms a closed cavity. A hole is formed in the side face of the cavity and is connected with a vacuum pipe. The upper surface of the sample supporting piece is composed of two faces. The left surface is parallel to the lower surface. An included angle between the right surface and the lower surface is less than 10 degrees. Holes are formed in the upper surface and are used for absorbing samples. The area, with a certain width, reserved on the area, close to the shared edge of the upper right surface, of the left upper surface is not provided with holes. The cleavage device is used for a sample table with certain flatness at scribing time.

Description

technical field [0001] The invention relates to a cleaving device, in particular to a cleaving device for semiconductor materials such as GaAs and InP. Background technique [0002] With the development and progress of science and technology, semiconductor materials are more and more used in optoelectronic devices, such as GaAs, InP and other materials. In the process of using these materials to manufacture optoelectronic devices, GaAs, InP and other materials need to be cleaved. At present, the existing cleavage process of GaAs, InP and other materials generally uses a diamond knife to cut a gap and then applies pressure by rolling with a roller to complete the cleavage. However, this method of cleavage will cause a large degree of mechanical damage to some devices whose surface structure is not pressure-resistant. At the same time, the roller directly contacts the surface of the chip, and the debris generated by the lobes is easy to adhere to the roller. A certain degree ...

Claims

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Application Information

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IPC IPC(8): H01L21/78
CPCH01L21/67092
Inventor 任知良王明刚王雪梅
Owner QINGDAO RUNXIN WEIYE TECH & TRADE