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Method for manufacturing inserts for electronic passports

一种制造方法、插件的技术,应用在机器使用的记录载体、计算机零部件、仪器等方向,能够解决制造效率下降等问题,达到避免装卸的效果

Inactive Publication Date: 2014-04-23
SMART PACKAGING SOLUTIONS SPS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It is known per se to compensate for the thickness margin due to the antenna by inserting a thickness compensation page, but it is a delicate implementation and represents additional cost and an additional risk of loss of manufacturing efficiency

Method used

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  • Method for manufacturing inserts for electronic passports
  • Method for manufacturing inserts for electronic passports
  • Method for manufacturing inserts for electronic passports

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0040] refer to figure 1 . In this figure a flow chart of a classical method for producing an electronic insert for a security document is shown. The first parallel steps 10, 11, 12 consist in providing the parts to be assembled, i.e. sheets or rolls of adhesive (step 10), substrate sheets of paper or plastic (step 11), antennas (step 12) and An electronic module (provided at step 13), the antenna is usually in the form of a very thin sheet with a metal antenna screen printed or stamped, printed, or even cousued (cousu) added to, the electronic module essentially A packaged electronic chip and a contact section for contacting a corresponding section of the antenna are included.

[0041] After the stage (10, 11, 12, 13) of providing components, some of which are presented in a format corresponding to several plugins (this is especially the case for carriers, which are presented in the form of pages of large size) , the part cutting (steps 14, 15, 16) is performed in order to...

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PUM

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Abstract

The invention relates to a method for manufacturing inserts (41) provided with an electronic module (44) supporting a chip and an antenna (43), comprising the steps of: supplying (30) top and bottom substrate sheets (46) for a plurality of inserts, said substrates being provided with cavities (42) for subsequently inserting an electronic module in each cavity; providing (31) an antenna for each insert; providing (33) at least one layer of adhesive; providing (32) an electronic module for each insert; (36) stacking and assembling by lamination (37) a bottom substrate sheet (46), a first layer of adhesive (54), a plurality of antennas (43), a second layer of adhesive (54) and a top substrate sheet (46); cutting (38) the laminated assembly such as to obtain inserts each provided with an antenna; inserting the electronic modules (44) in the cavities (42) after the step of laminating (37) the substrate sheets (46), antennas (43) and layers of adhesive (54). Said method is characterised by also comprising a step which consists of printing the inner surface of at least one of the substrate sheets (46) with a thickness-compensation layer (55), outside the substrate area (46) intended for receiving the antenna (43).

Description

technical field [0001] The invention relates to a new method of manufacturing electronic inserts for identification documents, in particular electronic passports, and to the insert structure obtained by implementing said method. Background technique [0002] PRIOR ART: Methods are known for the manufacture of electronic passports comprising, on the one hand, a book (livret) consisting of paper sheets which are folded and connected by a central binding (reliure), wherein the book pages At least one of them comprises a plurality of layers of plastic and / or paper and a flexible insert equipped with an electronic module and an antenna, said insert being integrated between two adjacent layers of a page equipped with an insert. [0003] Drawbacks of the prior art [0004] The manufacture of inserts that are currently used for documents such as electronic passports presents several problems. [0005] The first problem lies in the sequence of steps to manufacture the insert itself...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K19/077
CPCG06K19/07749G06K19/025Y10T29/49018
Inventor A.里佩尔P.沃尔佩Y-P.屈埃诺G.埃诺
Owner SMART PACKAGING SOLUTIONS SPS
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