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Wafer Grinding Equipment

A wafer and equipment technology, applied in the field of wafer grinding equipment, can solve the problems of complex structure and large size of wafer grinding equipment

Active Publication Date: 2017-09-22
FUJIKOSHI MACHINERY +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, a plurality of grinding heads are provided, and each grinding head corresponds to each grinding zone, so the structure of the wafer grinding apparatus must be complicated and its size must be large

Method used

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Experimental program
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Embodiment Construction

[0054] Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0055] First, the Minimal(TM) processing concept will be briefly explained.

[0056] In order to manufacture semiconductor devices on a large scale, the size of semiconductor wafers has increased. Recently, large wafers having a diameter of 300 mm or more are being used. To increase productivity, large wafers are subjected to continuous grinding, cleaning, drying, chemical vapor deposition (CVD), exposure, development, etching and final dicing, for example. To perform this series of steps, a large-scale manufacturing facility at a cost of billions of dollars is required.

[0057] However, for a wide range of applications, it is necessary to manufacture a wide variety of semiconductor devices in small quantities. The above-mentioned large-scale facilities are insufficient for a method of manufacturing a wide variety of products in small quantit...

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PUM

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Abstract

A wafer polishing apparatus includes a polishing plate, a polishing head capable of holding a wafer, and a polishing liquid supply unit. The grinding plate includes: a plurality of concentric grinding areas, each of which has a prescribed width for grinding a wafer and on which a grinding cloth is attached; and a groove for discharging a grinding liquid, which is formed in between grinding zones. A head cleaning portion for cleaning the grinding head or a wafer cleaning portion for cleaning the ground wafer is provided to the central portion of the grinding plate and inside the innermost grinding area.

Description

technical field [0001] The invention relates to a wafer grinding device. Background technique [0002] In conventional semiconductor wafer grinding equipment, the wafer to be ground is held by the wafer holding plate (carrier) of the grinding head, the surface of the wafer is brought into contact with the grinding cloth attached to the upper surface of the grinding plate, and With the polishing liquid supplied to the polishing cloth, the polishing plate and the polishing head are moved relative to each other so that the surface of the wafer can be polished. [0003] In the wafer grinding equipment disclosed in Japanese Patent Laid-Open No. 10-340870, dedicated grinding plates and mechanisms for different grinding processes are provided, for example, a grinding plate for primary grinding, a grinding plate for secondary grinding plate, grinding plate for fine grinding, wafer cleaning mechanism. [0004] In the wafer lapping apparatus disclosed in Japanese Patent Laid-Open No...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B37/10
CPCB24B7/228B24B37/105B24B37/16B24B37/26B24B37/30B24B37/345B24B53/017H01L21/02041H01L21/304
Inventor 中村由夫大塚美雄大久保贵史澁谷和孝布施贵之原史朗耸嘛玩池田伸一
Owner FUJIKOSHI MACHINERY