Component mounting system and component mounting method
A technology for components and joining components, which is applied in the field of component installation systems, can solve the problems of complex data structure and data management of position correction data, and achieve high-precision and simple assembly position correction.
Active Publication Date: 2017-10-24
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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Problems solved by technology
[0006] However, in the prior art described above, since the correction processing is performed independently, there are difficulties as described below
That is, in the above configuration, in addition to the correction value recognition algorithm for surface mount components on the component mounter side, it is necessary to have a correction value recognition algorithm for inserting components, and the data structure and data management of position correction data become complicated.
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[0035] Hereinafter, embodiments of the present invention will be described with reference to the drawings. First, refer to figure 1 , the structure of the component mounting system 1 will be described. The component mounting system 1 has a function of mounting electronic components on a substrate by solder bonding to manufacture a mounted substrate, and is configured by connecting a plurality of component mounting devices in series. Here, the component mounting apparatus M3 is connected downstream of the printing apparatus M1 and the printing inspection apparatus M2 connected in series.
[0036] Here, reference is made to the substrate 4 as the work object of the component mounting system 1. figure 2 Be explained. Such as figure 2 As shown, two identification marks 4 a for substrate position identification are formed at diagonal positions on the substrate 4 , and the position identification of the substrate 4 is performed by photographing and recognizing the identificati...
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PROBLEM TO BE SOLVED: To provide a component part mounting system and a component part mounting method capable of easily and precisely correcting mounting position while handling both of surface mounting component parts and insertion component parts.SOLUTION: The component part mounting system performs an inspection of solder printing position and insertion hole position prior to a component part mounting operation, and outputs the inspection result as a piece of solder printing position data and insertion hole position data, executes a mounting position correction processing to correct the mounting position of a component part to be joined based on the solder printing position data, executes an insertion position correction processing to correct an insertion position of a lead to be inserted into an insertion hole based on the insertion hole position data, and outputs the respective processing results as a single piece of mounting position correction data. In a component part mounting step, a component part to be joined to a substrate is mounted and the lead is inserted based on the mounting position correction data.
Description
technical field [0001] The present invention relates to a component mounting system and a component mounting method for manufacturing a mounting substrate by mounting electronic components on a substrate. Background technique [0002] A component mounting system that mounts electronic components on a substrate by soldering to manufacture a mounting substrate is constructed by connecting multiple components mounting devices such as a solder printing device, an electronic component mounting device, and a reflow device. In such a component mounting system, for the purpose of preventing mounting failures caused by deviations in printing positions between electrodes formed for solder bonding and solder on the substrate, it is known that the actual measurement of the solder printing position is obtained. A position correction technique in which solder position information is fed forward to a subsequent process (for example, refer to Patent Document 1). [0003] In the example sho...
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IPC IPC(8): H05K13/04
Inventor 永井大介伊藤克彦中岛诚
Owner PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD