Fan-out wafer level packaging structure and manufacturing process

Abstract

The invention relates to a fan-out-type wafer-level packaging structure and a manufacturing process. The packaging structure is characterized in that when the fan-out-type wafer-level packaging structure is manufactured, the process procedure that the front faces of chips are upward is adopted, a metal layer is manufactured on a carrier wafer firstly, and then through holes are formed according to the arrangement positions of the chips, or the metal layer provided with grooves is directly attached to the carrier wafer in an adhesive mode; the chips are attached to the grooves of the metal layer in an adhesive mode with the front faces of the chips upward, and then the plastic package process is carried out. Accordingly, the fan-out-type wafer-level packaging inner structure is changed, rigidity and the thermal coefficient of expansion of the structure are improved, and warping of the whole wafer and sliding and dislocation, caused by expansion and contraction of plastic package materials, of the wafer can be controlled; additionally, the metal material can play a better role in heat conduction and electromagnet shielding.

Description

technical field [0001] The invention relates to a fan-out wafer-level packaging structure and a manufacturing process, belonging to the technical field of semiconductor packaging. Background technique [0002] Fan-out wafer-level packaging is an embedded package processed at the wafer level, and it is also one of the main advanced packages with a large number of I / Os and good integration flexibility. Fan-out wafer-level packaging technology generally uses individual microchips cut from a wafer and then embedded on a new "artificial" wafer. When embedding, there must be sufficient spacing between microchips for fan-out rerouting. At present, it is very difficult to control the warpage of the fan-out packaging using the molding process. The solutions in the prior art are to reduce the warpage from the aspects of material properties and the final shape of the molding; It is also difficult to control the slippage and shift caused by (EMC) expansion and contraction. Contents ...

AI Technical Summary

Problems solved by technology

At present, it is very difficult to control the warpage of the fan-out packaging using the molding process. The solutions in the prior art are to reduce the warpage from the aspects of material properties and the final shape of the molding; It is also difficult to control the slip and shift caused by (EMC) expansion and contraction

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