Three-dimensional fan-out type PoP packaging structure and manufacturing process

Abstract

The invention relates to a three-dimensional fan-out type PoP packaging structure and a manufacturing process. Metal layers are manufactured on a carrying sheet through the process with the front faces of chips facing upwards, grooving is conducted according to the arrangement positions of the chips, and electrodes connected with other packaging units are manufactured according to the requirements. Rerouting layers are manufactured on the front faces of the chips after plastic package, and bonding pads of the chips are fanned out to form first layer chip circuits. Second layer chips are manufactured by repeating the process with the front faces of the chips facing upwards, and the corresponding chip and the corresponding metal layer are pasted on the first packaging unit so that the first packaging unit can be connected with the previous packaging unit. Plastic package, drilling and metal filling are then conducted, and RDL manufacturing is conducted on the second layer chips. Multiple layers of chips are stacked by repeating the stacking process, or lower bump metal layer manufacturing and ball planting are conducted on RDL layers. The carrying sheet is removed after ball planting is completed, a back face rerouting layer is arranged on the back face of each first layer chip, the corresponding packaging unit is obtained, and the packaging units are stacked to form the PoP packaging structure. According to the three-dimensional fan-out type PoP packaging structure and the manufacturing process, slip dislocation caused by warping and expansion and contraction of plastic package materials can be effectively reduced.

Description

technical field [0001] The invention relates to a three-dimensional fan-out PoP packaging structure and a manufacturing process, belonging to the technical field of semiconductor packaging. Background technique [0002] As the main way of packaging high-density integration at present, PoP (package on package, package on package) has received more and more attention. Chip stacking is the main way to increase the density of electronic packaging, and PoP design has been widely developed and applied in the industry. At present, it is very difficult to control the warpage of the PoP solution of the fan-out package using the molding process. The existing solutions are all to reduce the warpage from the aspects of material properties and the final shape of the molding; In addition, the slippage and shift caused by the expansion and contraction of the plastic encapsulant (EMC) are also difficult to control. Therefore, the yield rate of PoP packaging structure production becomes a ...

AI Technical Summary

Problems solved by technology

At present, it is very difficult to control the warpage of the PoP solution of the fan-out package using the molding process. The existing solutions are all to reduce the warpage from the aspects of material properties and the final shape of the molding; In addition, the slippage and shift caused by the expansion and contraction of the plastic packaging compound (EMC) are also difficult to control

Therefore, the yield rate of PoP packaging structure production has become a big problem

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