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A Method to Eliminate the Influence of Guide Rail Surface Shape on Overlay Deviation

A technology of overlay deviation and guide rail surface, which is applied in the direction of microlithography exposure equipment, photolithography exposure device, etc., can solve the problems affecting overlay performance, straightness deterioration, and rotation Rz, etc., and achieves the convenience of periodic maintenance Effect

Active Publication Date: 2016-06-01
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The straightness of the guide rail is usually guaranteed by the design through the simulation of the material characteristics in the early stage of research and development, but in the actual product use, due to long-term movement wear or other external factors, the guide rail will appear mechanical deformation and the straightness will deteriorate
The surface shape of the guide rail not only affects the positioning of the X and Y positions of the workpiece table, but also affects the rotation Rz, causing the workpiece table to be in different rotation postures when moving along the X or Y directions during exposure, which introduces in-field rotation and affects the overlay performance

Method used

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  • A Method to Eliminate the Influence of Guide Rail Surface Shape on Overlay Deviation
  • A Method to Eliminate the Influence of Guide Rail Surface Shape on Overlay Deviation
  • A Method to Eliminate the Influence of Guide Rail Surface Shape on Overlay Deviation

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Embodiment Construction

[0022] The method for eliminating the influence of the surface shape of the guide rail on the overprinting deviation of a specific embodiment of the present invention is described in detail below with reference to the accompanying drawings. However, it should be understood that the present invention is not limited to the embodiment described below, and the technical idea of ​​the present invention can be implemented in combination with other known technologies or other technologies having the same functions as those known technologies.

[0023] In the following description, in order to clearly show the structure and working mode of the present invention, many directional words will be used for description, but the words "front", "rear", "left", "right", "outer", "inner" should be used. "", "outward", "inward", "上", "下" and other words are understood as convenient terms and should not be understood as restrictive terms. In addition, "X direction" should be understood as a directio...

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Abstract

The present invention discloses a method for eliminating influence of a guide rail surface shape on overlap deviation. The method comprises: 1, uploading a silicon wafer having a mark, and setting a superposition state of the silicon wafer center and the work table center, wherein the silicon wafer does not rotate relative to the work-piece table; 2, setting a position setting value of the work-piece table to make the work-piece table move along the first direction, and measuring the position of the mark so as to obtain the actual rotation value of the work-piece table; and 3, carrying out linear fitting on the actual rotation value to obtain the compensation value of the influence of the guide rail surface shape on overlap, and calculating the actual rotation value of the exposure field according to the compensation value during exposure.

Description

Technical field [0001] The invention relates to the field of integrated circuit equipment manufacturing, in particular to a method for eliminating the influence of the surface shape of a rail on the offset of the overprinting used for a photoetching device. Background technique [0002] Photolithography, or optical etching, has been widely used in integrated circuit manufacturing processes. This technology is exposed through an optical projection device, and the designed mask pattern is transferred to the photoresist. The concepts of "mask" and "photoresist" are well-known in the photolithography process: a mask is also called a photomask, which is a film, plastic or glass with various functional patterns that are accurately positioned on the substrate. A stencil for selective exposure of the photoresist layer; photoresist is a colloidal liquid that is a mixture of photosensitive compounds, matrix resins, and organic solvents. After being exposed to specific wavelengths of light...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20
Inventor 李煜芝
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD