Parts mounting device and parts mounting method

A technology for mounting devices and components, applied in the direction of electrical components, electrical components, etc., can solve the problems of inability to achieve installation, electronic components do not fall, difficult to absorb electronic components, etc., to achieve the effect of improving productivity
CN103945682BActive Publication Date: 2018-05-01JUKI CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
JUKI CORP
Publication Date
2018-05-01

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Abstract

The invention provides a component mounting device and a component mounting method. The component mounting device properly mounts electronic components on a substrate irrelatively to the sizes and shapes of the electronic components. The component mounting device (1) utilizes a sucking nozzle (15) for sucking an electronic component (58). The electronic component is mounted on the substrate (W). Before the sucking nozzle sucks the electronic component, the orientation of the sucking nozzle is identified. Based on the identified orientation of the sucking nozzle, the sucking nozzle is rotated for a random angle. The front end of the sucking nozzle is provided with a plurality of sucking openings (25) which correspond with a plurality of sucking parts (59) that are preset on the electronic component for adjusting orientation of the sucking nozzle.
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Description

technical field

[0001] The present invention relates to a component mounting device and a component mounting method, which utilize suction

[0002] The suction nozzle sucks the electronic component supplied from the component supply device, and mounts it on the board. Background technique

[0003] Conventionally, as such a component mounting apparatus, there is known a technique of correcting the suction position and orientation of an electronic component suctioned by a suction nozzle and mounting it on a substrate (see Patent Documents 1 and 2). In the component mounting apparatus described in Patent Document 1, a light emitting unit and a light receiving unit are provided on a mounting head with suction nozzles interposed therebetween. Laser light is irradiated to the side of the electronic component held on the suction nozzle, and the orientation and mounting position of the electronic component on the board are corrected based on the shadow of the electronic component g...

Claims

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