Packaging method for organic light-emitting display panel and organic light-emitting display panel

An encapsulation method and light-emitting display technology, which can be applied to organic semiconductor devices, electrical components, electric solid-state devices, etc., and can solve problems such as difficulty in realizing a narrower frame design.

Active Publication Date: 2014-09-03
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The mask and ALD technology are used to coat the substrate with OLED. The step coverage of the film formed by ALD technology is better, and the area of ​​the film layer formed on the substrate corresponding to the hollow area of ​​the mask is larger than the area of ​​the hollow area. For example, in general, the film wrapping range formed by ALD technology is about 5-10mm, and the distance between the terminal electrode and the edge of the film package obtained by traditional mask technology is about 5-20mm, and it is difficult to achieve a narrower frame design

Method used

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  • Packaging method for organic light-emitting display panel and organic light-emitting display panel
  • Packaging method for organic light-emitting display panel and organic light-emitting display panel
  • Packaging method for organic light-emitting display panel and organic light-emitting display panel

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Embodiment approach

[0042] Method 1: remove all water and oxygen blocking layers in the binding area;

[0043] Method 2: remove the water-blocking oxygen layer on the connection terminals in the binding area, that is, retain the water-blocking oxygen layer outside the connection terminals.

[0044] The size and setting position of the binding area of ​​the organic light-emitting display panel are determined according to actual needs, for example, as figure 2 As shown, the size of the binding area 3 of the organic light emitting display panel may be equivalent to the area covered by the connection terminal 31 . The binding area 3 is located at an area extending a certain distance from the edge of the substrate to the center.

[0045] Such as image 3 As shown, the binding area 3 of the organic light emitting display panel is smaller than the area covered by the connecting terminal 31, and the binding area is a set distance away from the edge of the substrate.

[0046] In the specific implement...

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PUM

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Abstract

The invention discloses a packaging method for an organic light-emitting display panel and an organic light-emitting display panel. According to the packaging method for the organic light-emitting display panel, a narrow-border organic light-emitting display panel can be realized, and the problem that narrow border can not be realized in the traditional packaging method can be solved. The packaging method for the organic light-emitting display panel comprises steps of forming a water blocking oxide layer covering the whole substrate on the substrate where an organic light-emitting device and a peripheral binding region of a connection terminal are formed, carrying out etching on the water blocking oxide layer on the substrate, at least removing the water blocking oxide layer on the connection terminal in the binding region and keeping the water blocking oxide layer on the organic light-emitting device.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a packaging method of an organic light emitting display panel and the organic light emitting display panel. Background technique [0002] In the field of display technology, compared with traditional liquid crystal displays, organic light-emitting display panels have gradually become the mainstream in the display field due to their advantages such as fast response speed, wide color gamut, ultra-thin, and flexibility. [0003] The organic light emitting display panel is provided with a plurality of organic light emitting diodes (Organic Light Emitting Diode, OLED) arranged in a matrix and circuits in the peripheral binding area. The cathode of the organic light emitting diode is made of a more active metal, which is easily absorbed by the air. Oxidation by moisture and oxygen. Once the cathode is oxidized, the cathode and the organic layer materials in the OLED will be irreversi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/56H01L27/32
CPCH10K59/00H10K50/84H10K50/844H10K2102/00H10K71/00
Inventor 藤野诚治曾庆慧
Owner BOE TECH GRP CO LTD
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