10kv cable outer semiconductive layer combination cutter

Abstract

A 10 kv cable outer semiconductive layer combined cutting knife comprises a main knife rack and a vice knife rack; the main knife rack is in hinge joint with the vice knife rack by a fixing part, the rear end of the main knife rack is provided with a feeding rotary knob, a guide screw rod slide chute and a knife groove are successively, from bottom to top, arranged on the middle part of the main knife rack, the feeding rotary knob is connected with a feeding screw rod extending into the guide screw rod slide chute, the feeding screw rod is provided with a slide block, a blade is installed on the slide block, both sides of the blade extend into a knife groove, the front end of the main knife rack is provided with a blade pressing plate by a pressing plate fixing screw; a lateral feeding device is arranged on the main knife rack and between the knife groove and the blade pressing plate; a cable compressing device is arranged at a position on the vice knife rack, and the position is corresponding to the lateral feeding device. The 10 kv cable outer semiconductive layer combined cutting knife is designed to aim at a 10 kv cable outer semiconductive layer, longitudinal cutting and circular cutting can be realized by the same cutting knife, the cut surface cutting effect is coherent, tidy and free of burr, the post production is convenient, and the operation is simple, convenient, safe and reliable.

Description

technical field [0001] The invention relates to a cutter for stripping the outer semiconductive layer of a cable, in particular to a special tool suitable for making the outer semiconductive layer of a 10kV cable head. Background technique [0002] With the acceleration of the construction of urban and rural distribution networks, the use of 10kV cables in distribution lines is very large. A 10kV cable line needs to be made in addition to two terminal heads, and several intermediate heads need to be made at the intermediate joints. Heavy workload. The peeling and cutting of the outer semiconductive layer is an important task with particularly high technological requirements, especially the cut surface must be very coherent and neat without any burrs and unevenness. This part has the most concentrated electric field intensity and is the weakest part of the cable head. Most of the common accidents of the cable head are caused by this part. The quality of stripping and cuttin...

AI Technical Summary

Problems solved by technology

[0004] Aiming at the technical problems in the prior art that there is no special cutter for the slitting of the outer semiconducting layer of the 10kV cable, the rough cutting of the cable head caused by ordinary cable cutters and the unevenness after production lead to a large number of hidden dangers of accidents, the invention provides a 10kV cable The outer semi-conductive layer is combined with a cutting knife, which makes the feeding size of the blade accurately controlled, and the cut surface is coherent and neat, which greatly reduces the safety hazard of the distribution network cable

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