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Parameter optimization for printing solder paste on pcb

A solder paste and parameter technology, applied in the direction of assembling printed circuits with electrical components, printed circuits, printed circuit manufacturing, etc., to achieve reliable statistical results, rapid implementation, and improved performance.

Active Publication Date: 2018-06-01
ASM ASSEMBLY SYST GMBH & CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Even for experienced users, manual optimization of printing and cleaning parameters for a specific PCB is very labor-intensive based on

Method used

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  • Parameter optimization for printing solder paste on pcb
  • Parameter optimization for printing solder paste on pcb
  • Parameter optimization for printing solder paste on pcb

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0066] figure 1 A system 100 for generating optimized printing parameters and for performing printing of a printed circuit board (PCB) 190 is shown. The system 100 includes a solder paste printing (SPP) machine 110 , a solder paste inspection (SPI) machine 120 and a control device 130 . as from figure 1 It can be seen from the figure that the control device 130 is connected to the SPP machine 110 and to the SPI machine 120 at the same time. In the following, it will be described how a printing flow method for optimizing a PCB can be performed according to a preferred embodiment of the present invention.

[0067] At the beginning, a set of printing experiments is prepared by the control device 130 . Thus, each printing experiment is individually associated with a different setting of printing parameters for printing one PCB 190 of the plurality of PCBs. Corresponding data representing a plurality of printing parameter settings are forwarded from the control device 130 to th...

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PUM

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Abstract

In this document there is described a method for generating optimized parameters for printing a printed circuit board (190). The described method comprises the steps of (a) printing a plurality on printed circuit boards with a solder paste printing machine (110), wherein solder paste is applied in a controlled manner to each one of the plurality of printed circuit boards (190), (b) inspecting the resultant solder paste applied to the plurality of printed circuit boards (190) with a solder paste inspection machine (120), (c) analyzing inspection data obtained from inspecting the solder paste applied to the plurality of printed circuit boards (190), and (d) generating an optimized set of printing parameters for printing further printed circuit boards (190) based on the analyzed inspection data. Further, there are described a control device(130), a system (100) and a computer program, which are all configured for controlling and / or carrying the method for generating optimized parameters for a printed circuit board.

Description

technical field [0001] The present invention relates to the field of manufacturing printed circuit boards using methods of applying suitable quantities of solder paste at predetermined locations within the printed circuit board. These locations are lands for connecting terminals of electronic components to circuit patterns provided on the respective printed circuit boards. In particular, the invention relates to a method for optimizing the printing process of printed circuit boards. Furthermore, the invention relates to a control device, a system and a computer program, all of which are configured to control and / or load the method for optimizing the printing process of printed circuit boards. Background technique [0002] Automated production of electronic assemblies typically begins with a printed circuit board (PCB) printing process, where the appropriate amount of solder paste is applied at predetermined locations within the PCB. These locations represent lands for the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/34G06F17/50
CPCH05K1/0269H05K3/1216H05K3/3485H05K2203/163
Inventor 格里尔·马修格雷·罗伯特
Owner ASM ASSEMBLY SYST GMBH & CO