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heat sink

A heat sink and heat sink technology, applied in the direction of instruments, electrical digital data processing, digital data processing parts, etc., can solve problems such as difficult cleaning and inhalation of large dust

Active Publication Date: 2017-07-28
DONG GUAN YUNG TENG ELECTRONICS PROD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the more common radiators are air-cooled radiators. However, during the use of air-cooled radiators, a large amount of dust will be sucked in, which is not easy to clean.

Method used

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Embodiment Construction

[0028] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0029] It should be noted that when an element is referred to as being “disposed on” another element, it may be directly on the other element or there may also be an intervening element. When an element is referred to as being "between" two other elements, it can be directly between the other two elements or intervening elements may also be present. When an element is referred to as being "connected to" another element, it can be directly connected to the oth...

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PUM

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Abstract

A heat dissipation device comprises a base, a shell body, a connecting mechanism and a fan component, wherein the shell body and the connecting mechanism are arranged on the base, the fan component is arranged on the shell body, a heat dissipation groove and a guiding groove are formed in the base, the heat dissipation groove is located in the lateral side, facing the shell body, of the base, and the shell body is fixed to the base through the connecting mechanism; the shell body comprises a main body, a connecting frame and a guide rail, the connecting frame and the guide rail are arranged on the main body, a through hole is formed in the main body, the connecting frame is located in the through hole and covers part of the through hole, and the guide rail is arranged in the guiding groove in a sliding mode; the fan component is located in the through hole and arranged on the connecting frame, and the fan component is located on the side, away from the shell body, of the connecting frame. The heat dissipation device can be cleaned conveniently, quickly and easily. Furthermore, due to the fact that the connecting mechanism is simple in structure, the heat dissipation device is more suitable for bulk production, the qualified rate is high, and the yield of heat dissipation devices is improved to a certain degree.

Description

technical field [0001] The invention relates to the field of heat dissipation, in particular to a radiator. Background technique [0002] Computer is one of the most advanced scientific and technological inventions in the 20th century. It has had an extremely important impact on human production and social activities, and has developed rapidly with strong vitality. The application fields of computers have expanded from the initial military scientific research applications to various fields of society, and a huge computer industry has been formed, which has driven technological progress on a global scale. At present, computers have been widely popularized and become an indispensable tool in the information society. [0003] Since a large number of integrated circuits are used in computer components, a large amount of heat will be generated during the use of integrated circuits, and high temperature will lead to unstable operation of the system, shorten the service life of th...

Claims

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Application Information

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IPC IPC(8): G06F1/20
Inventor 卿国芳
Owner DONG GUAN YUNG TENG ELECTRONICS PROD