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Rigidity and flexibility combined printed board laminating method

A rigid-flexible, printed circuit board technology, applied in printed circuit manufacturing, printed circuit, multi-layer circuit manufacturing, etc., can solve problems such as low cost, air bubbles, delamination and inner layer deformation

Inactive Publication Date: 2015-01-07
WUXI CHANGHUI ELECTROMECHANICAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] For the lamination of rigid-flexible printed boards, all the inner layers are laminated together once more. This method has a short processing cycle and low cost, but there will be bubbles, delamination and inner layer deformation during lamination. This phenomenon It can only be found when the outer layer is etched, and the printed board can only be scrapped at this time

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0011] In order to ensure the balance of the lamination pressure and the flatness of the board, the size of the rigid base material and the prepreg and the blank of the prepreg are usually larger than the size of the rigid part plus the flexible part. Window, and put graphite gaskets up and down on the flexible plate of the window, or use the part punched out of the window as an auxiliary backing plate. The graphite gasket should be smooth and have mold release properties, which is conducive to the removal of the graphite gasket , the thickness of the graphite gasket is consistent with the thickness of the rigid outer layer, and the size of the graphite gasket matches the window. If the size of the graphite gasket is too small, irregular indentations will occur on the flexible window and affect the appearance; if the size of the graphite gasket is too large, Not conducive to disassembly and exhaust.

[0012] The invention can find out the deviation of inner layer graphics and ...

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PUM

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Abstract

The invention discloses a rigidity and flexibility combined printed board laminating method. The blank dimension of a rigid base material and the blank dimension of a prepreg are larger than the dimension of a rigid part plus a flexible part. A window of a flexible connection part is formed in an inner layer rigid thin plate through a milling machine, and graphite gaskets are placed above and under the portion, at the window, of a flexible plate. The graphite gaskets are as thick as a rigid outer layer and are matched with the window in size. The rigidity and flexibility combined printed board laminating method can find inner layer pattern deviation and lamination defects in time.

Description

technical field [0001] The invention relates to a method for manufacturing a printed board, in particular to a lamination method for a rigid-flexible printed board. Background technique [0002] For the lamination of rigid-flexible printed boards, all the inner layers are laminated together once more. This method has a short processing cycle and low cost, but there will be bubbles, delamination and inner layer deformation during lamination. This phenomenon It can only be found when the outer layer is etched, and the printed board can only be scrapped at this time. Contents of the invention [0003] Purpose of the invention: The present invention solves the above problems and provides a lamination method for rigid-flex printed boards that can detect inner-layer pattern deviation and lamination defects in time. [0004] Technical solution: a lamination method of rigid-flexible printed boards, the size of the rigid base material and the prepreg should be larger than the siz...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46
CPCH05K3/4611H05K2203/0195H05K2203/304
Inventor 杨彦涛
Owner WUXI CHANGHUI ELECTROMECHANICAL TECH
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