light emitting device
A technology of light-emitting devices and light-emitting elements, which is applied in semiconductor devices, electrical components, circuits, etc., and can solve the problems of discoloration and strength reduction of polyimide, deterioration of polyimide, and influence of insulation withstand voltage, etc.
Active Publication Date: 2018-09-11
NICHIA CORP
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Problems solved by technology
[0004] However, in the light-emitting device described in Patent Document 1, the polyimide substrate is exposed in a region where there is no conductive region, and light from the light-emitting element is irradiated to the exposed region to degrade the polyimide.
In particular, in flexible substrates such as polyimide substrates whose thickness is as thin as several tens of μm, discoloration and strength reduction of polyimide occur in exposed regions that have to be formed near light-emitting elements. and may affect the insulation withstand voltage
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[0051] Although this invention was described by the above-mentioned embodiment, it should not be understood that this invention is limited by description and drawing which make a part of this indication. Various alternative embodiments, examples, and operating techniques will be apparent to those skilled in the art from the above disclosure.
[0052] (1) In the above-described embodiment, the substrate 10 is provided with the wiring portions 12 and 13 , but the present invention is not limited thereto. The substrate 10 may have three or more wiring parts. In this case, the plurality of wiring portions may be arranged in the second direction. In addition, in this case, the light emitting element 30 and the sealing member 20 may be arranged on three or more wiring parts.
[0053] (2) In the above embodiment, one light emitting element 30 is connected to the wiring portions 12 and 13 , but two or more light emitting elements 30 may be connected to the wiring portions 12 and 13 ...
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An object of the present invention is to provide a light-emitting device capable of suppressing deterioration of a substrate. The light-emitting device of the present invention comprises: a base body (11) having a resin; a plurality of wiring parts (12, 13) arranged on the base body (11) via an adhesive (16); Separately provided grooves (14); light-emitting elements (30) arranged over at least a part of the grooves (14), the adhesive (16) extending so as to cover the grooves (14), the adhesive (16) ) includes a light shielding member for shielding light from the light emitting element (30).
Description
technical field [0001] The present invention relates to light emitting devices. Background technique [0002] Conventionally, a light-emitting device including a flexible light-emitting element arranged on a substrate using a resin material has been proposed (see Patent Document 1: JP2005-322937A). [0003] In the light-emitting device described herein, the light-emitting element is coupled to the conductive region formed on the polyimide substrate by flip-chip mounting via bumps or the like. [0004] However, in the light-emitting device described in Patent Document 1, the polyimide substrate is exposed in a region where there is no conductive region, and light from the light-emitting element is irradiated to the exposed region to degrade the polyimide. In particular, in flexible substrates such as polyimide substrates whose thickness is as thin as several tens of μm, discoloration and strength reduction of polyimide occur in exposed regions that have to be formed near lig...
Claims
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IPC IPC(8): H01L33/48H01L33/56H01L33/54
CPCH01L33/48H01L33/501H01L33/502H01L33/54H01L33/56H01L33/58H01L33/60H01L33/50H01L2224/73204H01L33/505
Inventor 大黑弘树山田元量藤川康夫
Owner NICHIA CORP