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Printed circuit board and method of manufacturing the same

A technology of printed circuit board, manufacturing method, applied in the direction of printed circuit manufacturing, printed circuit, printed circuit, etc.

Inactive Publication Date: 2015-04-29
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, by performing a separation process, the structure becomes a vertically asymmetric structure, and the warpage occurs during copper plate etching, eventually causing various problems

Method used

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  • Printed circuit board and method of manufacturing the same
  • Printed circuit board and method of manufacturing the same
  • Printed circuit board and method of manufacturing the same

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Embodiment Construction

[0024] The objects, features and advantages of the present invention will be more clearly understood through the following detailed description of preferred embodiments in conjunction with the accompanying drawings. In the drawings, the same reference numerals are used to designate the same or similar components, and redundant descriptions are omitted here. In addition, in the following description, "first", "second", "one side", "another side" and similar terms are used to distinguish a certain component from other components, but the structure of these components should not be construed as being limited by these terms. In addition, in the specification of the present invention, when it is determined that a detailed description of related art will obscure the gist of the present invention, the related description will be omitted.

[0025] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0...

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PUM

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Abstract

Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board according to the present invention may include: a plurality of circuit layers; and a plurality of insulating layers interposed between the plurality of circuit layers, wherein two adjacent insulating layers of the plurality of insulating layers have different thicknesses.

Description

[0001] Cross References to Related Applications [0002] This application claims the priority of Korean Patent Application No. 10-2013-0122127, filed on October 14, 2013, entitled "Printed Circuit Board and Manufacturing Method Thereof", the entire contents of which are hereby incorporated by reference as References are incorporated into this application. technical field [0003] The invention relates to a printed circuit board and a method for manufacturing the printed circuit board. Background technique [0004] According to the recent trend toward miniaturization and multi-functionalization in the field of electronic components, highly integrated devices manufactured by applying precise patterns and stacked structures to existing printed circuit boards to maximize radiation characteristics Thin products are increasingly demanded by users. In this case, a coreless product applying a detached carrier can have the characteristics of thin thickness, small resistance, and hi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K3/00
CPCH05K3/4682H05K2201/09136H05K2201/0191H05K2201/0352H05K3/4647H05K2201/029H05K2203/025H05K3/007
Inventor 姜互植朴钟泰
Owner SAMSUNG ELECTRO MECHANICS CO LTD