Apparatus and methods for handling workpieces of different sizes
A workpiece and equipment technology, applied in the field of workpiece processing equipment, can solve problems such as damage, contaminated particles, and contaminated workpieces
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[0019] refer to figure 1 , a processing chamber 10 for use with a plasma processing system generally includes: a vacuum vessel or housing having a cover 14 and a base 16 on which the cover 14 rests; a lower electrode 24; an upper electrode (not shown); and an assembly 48 located inside the processing chamber 10 for automatically transferring wafers to and from the lower electrode 24 . Cover 14 is mechanically coupled to a lifting device (not shown) that enables lifting and lowering of cover 14 relative to base 16 between a raised position and a lowered position. When the cover 14 and base 16 are in contacting relationship, the processing zone is defined as bounded vertically between the inwardly facing horizontal surfaces of the electrodes and laterally inwardly of the inwardly facing vertical surfaces of the side walls defined by the split ring Space. When the cover 14 is in the raised position, the machining area can be accessed to insert unmachined workpieces 28, 30 ( F...
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