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Apparatus and methods for handling workpieces of different sizes

A workpiece and equipment technology, applied in the field of workpiece processing equipment, can solve problems such as damage, contaminated particles, and contaminated workpieces

Active Publication Date: 2015-05-06
NORDSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Also, contact between the lift pins and the workpiece can damage or contaminate the backside of the workpiece
Additionally, the lifting and lowering process of the lift pins can generate particles that contaminate the process chamber and, if not corrected, can eventually lead to contamination of the machined workpiece

Method used

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  • Apparatus and methods for handling workpieces of different sizes
  • Apparatus and methods for handling workpieces of different sizes
  • Apparatus and methods for handling workpieces of different sizes

Examples

Experimental program
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Embodiment Construction

[0019] refer to figure 1 , a processing chamber 10 for use with a plasma processing system generally includes: a vacuum vessel or housing having a cover 14 and a base 16 on which the cover 14 rests; a lower electrode 24; an upper electrode (not shown); and an assembly 48 located inside the processing chamber 10 for automatically transferring wafers to and from the lower electrode 24 . Cover 14 is mechanically coupled to a lifting device (not shown) that enables lifting and lowering of cover 14 relative to base 16 between a raised position and a lowered position. When the cover 14 and base 16 are in contacting relationship, the processing zone is defined as bounded vertically between the inwardly facing horizontal surfaces of the electrodes and laterally inwardly of the inwardly facing vertical surfaces of the side walls defined by the split ring Space. When the cover 14 is in the raised position, the machining area can be accessed to insert unmachined workpieces 28, 30 ( F...

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PUM

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Abstract

Apparatus and methods for plasma processing workpieces of different diameters. The apparatus includes a lift plate having an outer perimeter, an opening inside of the outer perimeter, and a gap extending between the opening and the outer perimeter. The lift plate includes annular rims of different inner diameters and that are configured to respectively support the first and second workpieces.

Description

technical field [0001] The present invention relates generally to apparatus and methods for workpiece processing, and more particularly, to apparatus and methods for transferring substrates of various sizes to and from electrodes of a plasma processing system. Background technique [0002] Processing systems such as plasma processing tools rely on holding mechanisms to support workpieces such as semiconductor, ceramic or metal substrates or wafers inside the processing chamber during the processing process. Some holding mechanisms include lift pins configured to be raised or lowered in unison to raise and lower the workpiece relative to the top surface of the support. In the lowered position, the ends of the lift pins are either flush with the top surface of the support or are slightly recessed below the top surface of the support such that the workpiece at least partially contacts the top surface. In the raised position, the ends of the lift pins contact the bottom surface...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/677H01L21/687
CPCH01L21/67742H01L21/67751H01L21/68735H01L21/68771C23C16/4583C23C16/458C23C16/4582C23C16/4585H01L21/67745H01L21/67748
Inventor 詹姆斯·P·法西奥大卫·K·富特詹姆士·D·格蒂
Owner NORDSON CORP