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A kind of stencil printing process and mold

A technology of stencil printing and craftsmanship, applied in the direction of screen printing machines, printing machines, printing machines, etc., can solve problems such as impracticability, and achieve the effect of ensuring quality

Inactive Publication Date: 2017-07-21
SHENZHEN REFOND OPTOELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Stencil printing is often used to print solder on circuit boards and other devices. Its principle is similar to silk screen printing. It also uses the principle of printing plate mesh to penetrate the slurry. Under the extrusion of the scraper, the slurry (usually solder paste) ) is transferred to the substrate (usually a circuit board) through the mesh, and a predetermined pattern is formed on the substrate. The existing stencil printing technology can easily print on planar objects, but for non-planar cavities such as cups and bowls printing, the existing stencil printing technology cannot be implemented

Method used

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  • A kind of stencil printing process and mold
  • A kind of stencil printing process and mold
  • A kind of stencil printing process and mold

Examples

Experimental program
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Effect test

Embodiment Construction

[0011] The stencil printing process and the mold of the present invention are used to print patterns in the cavities of non-planar objects, such as cups and bowls. Taking the printing of solder paste patterns in the cup cavity 10 as an example, the process of the present invention and the mold Describe in detail.

[0012] First, if figure 1 and figure 2 As shown, the corresponding mold 20 is designed according to the inner shape and size of the cavity 10 to be printed and the mold 20 is placed on the cavity 10 . The mold 20 can be made of metal, plastic, synthetic material, etc., and includes at least a certain template 21 and a movable template 22 , wherein the movable template 22 can move relative to the fixed template 21 . Corresponding to the cavity 10 , the fixed die plate 21 and the movable die plate 22 respectively protrude outward to form bosses 23 , 24 .

[0013] The fixed template 21 is used as a printing plate, and a through mesh 27 is formed on the bottom surfa...

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PUM

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Abstract

A stencil printing process, comprising: forming a mold according to the internal structure of the cavity and installing the mold on the cavity, the mold includes a fixed template and a movable template, the fixed template is installed on the cavity and forms an extendable The boss that enters the cavity, the bottom surface of the boss is formed with a mesh, the movable template is installed on the fixed template and formed with a boss, the boss of the movable template can extend into the boss of the fixed template And can move laterally relative to the fixed template, the bottom surface of the boss of the movable template is formed with perforations corresponding to the mesh; inject printing materials into the mold, the printed materials pass through the perforations of the movable template and enter the mesh of the fixed template to form a printing pattern Promote the movable template to move relative to the fixed template, the bottom surface of the boss of the movable template at least partially covers the mesh of the boss of the fixed template; and demoulding, the mold is taken out from the cavity, the present invention forms the boss on the mold Realize the internal printing of the cavity, and ensure the quality of the printed pattern through the relative movement of the mold.

Description

technical field [0001] The invention relates to steel screen printing, in particular to a steel screen printing process and a used mold. Background technique [0002] Stencil printing is often used to print solder on circuit boards and other devices. Its principle is similar to silk screen printing. It also uses the principle of printing plate mesh to penetrate the slurry. Under the extrusion of the scraper, the slurry (usually solder paste) ) is transferred to the substrate (usually a circuit board) through the mesh, and a predetermined pattern is formed on the substrate. The existing stencil printing technology can easily print on planar objects, but for non-planar cavities such as cups and bowls Printing, the existing steel screen printing technology can not be implemented. Contents of the invention [0003] In view of this, a steel screen printing process and a mold are provided, which can perform pattern printing in a cavity. [0004] A stencil printing process, sui...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B41M1/12B41F15/08
Inventor 游志裴小明
Owner SHENZHEN REFOND OPTOELECTRONICS