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Fault mode and impact analysis method of modularized system design

A failure mode and system design technology, applied in the field of electronics, can solve problems such as error analysis results and failure to reflect the intensity of influence

Inactive Publication Date: 2015-06-24
XIDIAN UNIV +1
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Problems solved by technology

However, the deficiency still exists in this patent application is that in the analysis process, although the influence of other modules of the subsystem on the analysis module is considered, the strength of the influence is not reflected, and the analysis results with errors may be obtained

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  • Fault mode and impact analysis method of modularized system design
  • Fault mode and impact analysis method of modularized system design
  • Fault mode and impact analysis method of modularized system design

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Embodiment Construction

[0049] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0050] Refer to attached figure 1 , a failure mode and effect analysis method for componentized system design provided by the present invention, comprising the following steps:

[0051] Step 1, describe the system failure mode.

[0052] The failure mode refers to the description of the phenomenon when the system fails; due to the limitation of the site conditions, the observed or measured failure phenomenon may be systematic, such as the engine cannot be started; it may also be a certain component, such as the transmission box has abnormal noise. ; It may also be a specific part, such as a broken track, a broken oil pipe, etc.

[0053] According to the functions and requirements of the system, the user extracts the information required by the potential failure mode and impact analysis table and the interaction description table between failure modes from th...

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Abstract

The invention discloses a fault mode and impact analysis method of modularized system design. The fault mode and impact analysis method can be used for reliability analysis and evaluation of modularized electronic product system design. The method comprises the following steps: 1, describing the system fault mode; 2, determining judgment levels of fault risk factors; 3, generating primary fault mode risk ranking; 4, establishing a stratification analysis model graph; 5, transforming the analysis model graph into an analysis model matrix; 6, calculating the analysis model matrix, and obtaining a fault mode correction vector; 7, using the fault mode correction vector for correcting the primary fault mode risk ranking, obtaining system fault mode risk ranking, and finding the fault mode with high risk according to the ranking. By means of the fault mode and impact analysis method of the modularized systematic design, it is convenient for a user to achieve dynamic analysis and accurate analysis on the reliability of the modularized electronic product system design at an early stage of the modularized electronic product system design, system weak links are found, and the basis for making improvement measures is provided.

Description

technical field [0001] The invention belongs to the field of electronic technology, and further relates to a failure mode and impact analysis method for componentized system design in the technical field of componentized electronic product system design. The invention is suitable for analyzing the reliability of the componentized electronic product system design in the early stage of the componentized electronic product system development. Background technique [0002] As various electronic product systems are widely used in various fields of people's work and life, people's requirements for the reliability of electronic product systems are getting higher and higher, so the reliability research of electronic product systems has become a new direction for the development of electronic technology. Reliability is an inherent attribute of electronic product systems, which refers to the ability of electronic product systems to correctly perform the key functions of their required...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F19/00
Inventor 孙聪马建峰崔西宁马勇牟明戴小氐焦政达张帅
Owner XIDIAN UNIV
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