Light-emitting diode film circuit board and decorative materials
A technology of light-emitting diodes and thin-film circuit boards, which is applied in the direction of printed circuits and electrical components connected by circuits, non-printed electrical components, etc., can solve the problems of general products without suitable structure and inconvenience.
Inactive Publication Date: 2017-11-28
JENSIN INTL TECH CORP
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AI Technical Summary
Problems solved by technology
[0005] It can be seen that above-mentioned existing light-emitting diodes obviously still have inconvenience and defects in structure and use, and need to be further improved urgently.
In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but for a long time no suitable design has been developed, and the general product has no suitable structure to solve the above-mentioned problems. This is obviously the relevant industry. Urgent problem
Method used
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Embodiment Construction
[0045] In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, the specific implementation methods, Structure, characteristic and effect thereof are as follows in detail.
[0046] figure 1 is a partially exploded schematic diagram of a light-emitting diode thin film circuit board according to an embodiment of the present invention, and figure 2 for figure 1 Schematic diagram of the A-A section line. Please also refer to figure 1 and figure 2 The LED thin film circuit board 100 includes a thin film substrate 110 , a first conductive metal wire 120 , a second conductive metal wire 130 and a plurality of LEDs 140 . The film substrate 110 has an opposite first side 112, a second side 114, and an inner region 116 between the first side 112 and the second side 114, and the first conductive metal line 120 is disposed on the first side 112 and the second side 114. The second conductive metal line 1...
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The invention relates to a light-emitting diode film circuit board and a decorative material. The decoration material includes a base material and a light-emitting diode film circuit board arranged thereon. The LED thin film circuit board includes a thin film substrate, a first conductive metal wire, a second conductive metal wire and a light emitting diode. The film substrate has opposite first sides, a second side and an inner region between the first side and the second side. The material of the first conductive metal wire is different from that of the second conductive metal wire, and the impedance of the first conductive metal wire is lower than the impedance of the second conductive metal wire. The light emitting diode is disposed on the second conductive metal line and is electrically connected with the second conductive metal line. Using this configuration method, it is possible to improve the uneven brightness of the light-emitting diodes when used in a large area, and then the light-emitting diode film circuit board can be applied to decorative materials for large-area decoration, expanding the application area of light-emitting diodes .
Description
technical field [0001] The invention relates to a circuit board and a decorative material, in particular to a light-emitting diode film circuit board with uniform brightness and a decorative material using the light-emitting diode film circuit board. Background technique [0002] Light-emitting diodes have advantages such as long life, small size, high shock resistance, low heat generation, and low power consumption, so they have been widely used as indicators or light sources in households and various equipment. In recent years, light-emitting diodes have been developed towards high power, so their application fields have been expanded to road lighting, large outdoor signage, traffic lights and related fields. [0003] In general, the LED light source module is configured with a plurality of LED chips arranged in a matrix on the substrate. However, the electrical impedance of the conductive lines configured on the substrate for transmitting power will be proportional to th...
Claims
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IPC IPC(8): H01L33/62H05K1/18
Inventor 郑旭峰
Owner JENSIN INTL TECH CORP