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Welding Chopping Knife

A ribbing, polycrystalline technology, used in welding equipment, non-electric welding equipment, manufacturing tools, etc.

Active Publication Date: 2017-09-15
TOTO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, even in the case of using the technology disclosed in Patent Document 1, there is still room for improvement in the improvement of wear resistance.

Method used

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Experimental program
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Embodiment Construction

[0017] The first invention is a welding capillary characterized by comprising polycrystalline ceramics having alumina crystals as the main phase, pores in the polycrystalline ceramics having an occupancy rate of 90 ppm or less and having a diameter of 3 μm or more. The pores are 13 / mm 2 the following.

[0018] According to this welding capillary, since the ratio of pores present in the polycrystalline ceramic structure can be reduced, the wear resistance of the welding capillary can be further improved.

[0019] A second invention is a welding capillary characterized in that, in the first invention, the average particle diameter of the alumina crystal particles is 0.68 μm or less.

[0020] According to this welding capillary, the wear resistance of the welding capillary can be further improved.

[0021] A third invention is a welding capillary in the first invention, wherein the average particle diameter of the alumina crystal particles is 0.35 μm or less.

[0022] Accordin...

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Abstract

The present invention provides a welding capillary, which is characterized in that it contains polycrystalline ceramics with alumina crystals as the main phase, the occupancy of pores in the polycrystalline ceramics is 90 ppm or less, and the pores with a diameter of 3 μm or more are 13 pieces / mm2 or less. Improvement in wear resistance can be achieved.

Description

technical field [0001] The aspect of the present invention generally relates to a welding capillary, and specifically relates to a welding capillary suitable for use of thin hard metal wire (welding wire) containing copper or the like. Background technique [0002] In the wire bonding for connecting the semiconductor element and the lead of the lead frame with a thin metal wire, one end of the thin metal wire is bonded to the electrode pad (the first pad) using a soldering knife, and then the thin metal wire is guided to be bonded to the lead (the first pad). Two solder joints). When joining thin metal wires, ultrasonic waves are applied while pressing the thin metal wires with a welding capillary. [0003] In recent years, attempts to use copper, which is cheaper than gold, as a material for thin metal wires have been expanding. However, when using thin metal wires containing copper, which is harder than gold, it is necessary to increase the amplitude of ultrasonic waves ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/60C04B35/10
CPCB23K20/005B23K20/106C04B35/111C04B35/6455H01L24/78H01L24/45H01L2224/45147H01L2224/78309H01L2924/01322B23K2101/42C04B2235/3241C04B2235/3244C04B2235/3206C04B2235/3225C04B2235/784C04B2235/786C04B2235/96H01L2924/00014H01L2924/00H01L2924/181H01L2224/78301
Inventor 本村研一大西惇平樱井卫冰室正一郎内村健志后藤达也田端研二
Owner TOTO LTD
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