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Segmentation device

A technology for holding components and workpieces, which is applied in the directions of fine work equipment, electrical components, work accessories, etc., and can solve the problems of equipment cost and increase of equipment installation space.

Active Publication Date: 2015-09-30
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in the above structure, a fracture device is required in addition to the processing device for forming the division starting point for fracture processing, and there is a problem that the cost of the device and the installation space of the device increase.

Method used

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Experimental program
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Embodiment Construction

[0033] Hereinafter, this embodiment will be described with reference to the drawings. figure 1 It is a perspective view of the division apparatus of this embodiment. In addition, in this embodiment, although the dividing apparatus provided with a pair of cutting blade was shown as an example, it is not limited to this structure. Any dividing device can be applied as long as it can process a wafer using a cutting tool.

[0034] like figure 1 As shown, the dividing device 1 is configured to process the workpiece W by relatively moving the workpiece W held by the holding member 12 and the pair of cutting members 16 . The workpiece W is formed in a substantially plate shape from a ceramic, glass, or sapphire-based optical device wafer. The front surface 71 of the workpiece W is divided by grid-like dividing lines 73 (refer to image 3 (A)) is divided into a plurality of regions, and an optical device such as an LED is formed in each region. In addition, the workpiece W is not...

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PUM

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Abstract

The invention provides a segmentation device which restrains increasing of device cost and space occupation of the device, and improves performance. The segmentation device (1) is a device which uses a cutting tool (63) installed on a spindle box (61) to cut and process a processed object (W) on a maintaining component (12). The device comprises a camera component (66) which takes pictures of the processed object on the maintaining component, moving components (13, 14, 15) which make the spindle box relatively move relative to the maintaining component, and a pressing blade (67) which protrudes downward from the spindle box in a manner of pressing the processed object on the maintaining component. According to images of the processed object, shot by the camera component, the pressing blade is moved by the moving components (13, 14, 15).

Description

technical field [0001] The present invention relates to a dividing device for dividing a workpiece into individual devices. Background technique [0002] On the front surface of a workpiece such as an LED wafer or a sapphire wafer, devices such as ICs, LSIs, and LEDs are formed in regions divided by planned dividing lines. Chips are manufactured by cutting the workpiece along planned dividing lines. As a device for dividing such a workpiece into individual chips, there is known a device that applies a bending stress to the workpiece by breaking after forming a scribe line or a modified layer along a planned dividing line and The workpiece is divided along the planned dividing line to manufacture individual chips (for example, refer to Patent Document 1). [0003] Usually, in such a fracturing device, a pair of elongated support stands are arranged at intervals, a pressing blade is arranged above the pair of support stands, and a calibration camera is arranged below the pai...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/02B28D5/04B28D7/00H01L21/67
CPCB28D5/0011B28D5/0082B28D5/022B28D5/04H01L21/67
Inventor 铃木稔齐藤诚井上高明
Owner DISCO CORP