Unlock instant, AI-driven research and patent intelligence for your innovation.

Separation device

A technology for holding components and workpieces, which is applied in the directions of fine work equipment, electrical components, work accessories, etc., and can solve the problems of equipment cost and increase of equipment installation space.

Active Publication Date: 2018-06-01
DISCO CORP
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in the above structure, a fracture device is required in addition to the processing device for forming the division starting point for fracture processing, and there is a problem that the cost of the device and the installation space of the device increase.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Separation device
  • Separation device
  • Separation device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0033] Hereinafter, this embodiment will be described with reference to the drawings. figure 1 It is a perspective view of the division apparatus of this embodiment. In addition, in this embodiment, although the dividing apparatus provided with a pair of cutting blade was shown as an example, it is not limited to this structure. Any dividing device can be applied as long as it can process a wafer using a cutting tool.

[0034] Such as figure 1 As shown, the dividing device 1 is configured to process the workpiece W by relatively moving the workpiece W held by the holding member 12 and the pair of cutting members 16 . The workpiece W is formed in a substantially plate shape from a ceramic, glass, or sapphire-based optical device wafer. The front surface 71 of the workpiece W is divided by grid-like dividing lines 73 (refer to image 3 (A)) is divided into a plurality of regions, and an optical device such as an LED is formed in each region. In addition, the workpiece W is ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention provides a dividing device which suppresses increases in device cost and installation space of the device, and improves workability. The dividing device (1) of the present invention is a device for cutting a workpiece (W) on a holding member (12) by using a cutting tool (63) mounted on a headstock (61), and is configured to include: An imaging member (66) for imaging the workpiece on the member; a moving member (13, 14, 15) for relatively moving the headstock with respect to the holding member; The pressing blade (67) protruding downward from the headstock is moved by the moving means based on the captured image of the workpiece captured by the imaging means.

Description

technical field [0001] The present invention relates to a dividing device for dividing a workpiece into individual devices. Background technique [0002] On the front surface of a workpiece such as an LED wafer or a sapphire wafer, devices such as ICs, LSIs, and LEDs are formed in regions divided by planned dividing lines. Chips are manufactured by cutting the workpiece along planned dividing lines. As a device for dividing such a workpiece into individual chips, there is known a device that applies a bending stress to the workpiece by breaking after forming a scribe line or a modified layer along a planned dividing line and The workpiece is divided along the planned dividing line to manufacture individual chips (for example, refer to Patent Document 1). [0003] Usually, in such a fracturing device, a pair of elongated support stands are arranged at intervals, a pressing blade is arranged above the pair of support stands, and a calibration camera is arranged below the pai...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/301B28D5/02B28D5/04B28D7/00H01L21/67
Inventor 铃木稔齐藤诚井上高明
Owner DISCO CORP