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Submodule topology

A seed module and sub-module technology, which is applied to output power conversion devices, electrical components, and AC power input to DC power output, etc., can solve the problems of a large number of sub-units and a large number of fully-controlled semiconductor devices used.

Active Publication Date: 2015-09-30
INST OF ELECTRICAL ENG CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the use of full-bridge sub-units results in a large number of sub-units, and a large number of fully-controlled semiconductor devices are used

Method used

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Examples

Experimental program
Comparison scheme
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Embodiment 1

[0069] Such as figure 1 Shown is Embodiment 1 of the present invention, the sub-module topology includes a first capacitor group C1 and a second capacitor group C2, a first fully-controlled semiconductor device T1, a second fully-controlled semiconductor device T2, a third fully-controlled semiconductor device type semiconductor device T3, the fourth fully controlled semiconductor device T4, the fifth fully controlled semiconductor device T5, the sixth fully controlled semiconductor device T6, the seventh fully controlled semiconductor device T7 and the eighth fully controlled semiconductor device T8.

[0070] Wherein the first fully-controlled semiconductor device T1 , the second fully-controlled semiconductor device T2 and the first capacitor group C1 form the first half-bridge subunit 11 . The collector of the first fully-controlled semiconductor device T1 is connected to the positive pole of the first capacitor group C1, and this connection point is used as the first lead-...

Embodiment 2

[0076] Such as figure 2 Shown is Embodiment 2 herein, the seventh fully-controlled semiconductor device T7 and the eighth fully-controlled semiconductor device T8 can be replaced by wires. That is, the second lead-out terminal 2 of the first half-bridge subunit is used as the first lead-out terminal 7 of the submodule, and the second lead-out terminal 5 of the second half-bridge subunit is used as the second lead-out terminal 8 of the submodule .

Embodiment 3

[0078] Such as image 3 Shown is embodiment 3 of this paper, the seventh fully controlled semiconductor device T7, the eighth fully controlled semiconductor device T8, the third fully controlled semiconductor device T3, and the sixth fully controlled semiconductor device T6 are composed of two Fully controlled semiconductor devices are connected in series.

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Abstract

A submodule topology comprises a first capacitor group (C1) and a second capacitor group (C2), as well as a first full control type semiconductor device (T1), a second full control type semiconductor device (T2), a third full control type semiconductor device (T3), a fourth full control type semiconductor device (T4), a fifth full control type semiconductor device (T5), a sixth full control type semiconductor device (T6), a seventh full control type semiconductor device (T7) and an eighth full control type semiconductor device (T8).

Description

technical field [0001] The invention relates to a modular converter sub-module topology. Background technique [0002] Self-control of the converter is used to realize self-clearing of DC side faults without mechanical equipment action, so the system recovers quickly. Finding new converters with DC fault ride-through capability is currently a research hotspot in academia and industry. In 2010, ALSTOM proposed a variety of hybrid converters combining the structural characteristics of traditional two-level converters and MMCs at the International Conference on Large Power Grids. All level converters have DC fault ride-through capability. However, the use of full-bridge sub-units results in a large number of sub-units, and a large number of fully-controlled semiconductor devices are used. Contents of the invention [0003] The purpose of the present invention is to overcome the disadvantages of the prior art and propose a sub-module topology. [0004] The sub-module topolo...

Claims

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Application Information

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IPC IPC(8): H02M7/00
Inventor 朱晋韦统振霍群海
Owner INST OF ELECTRICAL ENG CHINESE ACAD OF SCI