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Substrate Treating Apparatus

A substrate processing device and substrate technology, which can be used in transportation and packaging, electrical components, semiconductor/solid-state device manufacturing, etc., and can solve problems such as adverse effects of substrate processing technology

Active Publication Date: 2015-10-14
SEMES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Particles in the housing 2 due to friction between the baffle 4 and the housing 2 may have an adverse effect on the substrate processing process

Method used

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  • Substrate Treating Apparatus
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  • Substrate Treating Apparatus

Examples

Experimental program
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Embodiment Construction

[0020] Embodiments will be described in detail with reference to the drawings. However, the invention may be embodied in various different forms and should not be construed as being limited to only the illustrated embodiments. Rather, these embodiments are provided as examples so that this description will be thorough and complete, and will fully convey the concept of the invention to those skilled in the art. Accordingly, some embodiments of the invention do not describe known processes, elements and techniques. Unless otherwise noted, like reference numerals denote like elements throughout the drawings and the specification, and therefore description will not be repeated. In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity of illustration.

[0021] It should be understood that although the terms "first", "second" and "third" etc. may be used herein to describe various elements, components, regions, layers and / or sections, these...

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PUM

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Abstract

A substrate treating apparatus is provided which includes housing and a door assembly. The housing provides a process space for treating a substrate therein and has an opening formed at a sidewall thereof. The door assembly opens and closes the opening. The door assembly includes a shutter, a driving member, and a gap maintaining unit. The driving member transfers the shutter to an open position where the shutter faces to the opening and to a blocking position where the shutter gets out of the open position. The gap maintaining unit maintains a constant gap between the shutter and the sidewall.

Description

technical field [0001] Embodiments of the invention described herein relate to a substrate processing apparatus. Background technique [0002] To manufacture semiconductor devices or liquid crystal displays, substrates can be processed using the following processes: photolithography, etching, ashing, ion implantation, and thin film deposition, among others. In order to remove contaminants or particles generated during each process, a wafer cleaning process may be performed before and after the process. [0003] In general, substrate processing may be performed within the interior space of the housing. When the substrate is processed, if the substrate is inserted through an inlet formed in the case, the inlet may be blocked by the shutter. During processing a downflow airflow can form in the housing and can prevent the diffusion of process by-products generated in the interior space. [0004] figure 1 is a plan view of a conventional substrate processing apparatus. refer...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/677H01L21/67
CPCB08B3/02H01L21/6719H01L21/67051H01L21/67126H01L21/67023H01L21/67742
Inventor 李相臻崔知焄金斗镇
Owner SEMES CO LTD