Holding device and vacuum handling device

Abstract

The invention provides a holding device and a vacuum treatment device. A held object is subjected to vacuum treatment, while exhaust gas on an adhesive pad is not discharged to vacuum environment. The adhesive pad (17) is arranged in a vacuum device (15) of the holding device (11). When the held object (5) is kept in an adhesion state, a contact part (18) on the edge of the vacuum device (15) is pressed to enable inner space (25) of the vacuum device (15) to be separated from outer space (26). The inner space (25) of the vacuum device (15) is subjected to vacuum exhaust in advance via an exhaust vent (14) in the vacuum device (15). When vacuum treatment is carried out, the exhaust vent (14) is in a state with no gas passing through, so that the exhaust gas from the adhesive pad (17) is not discharged to the environment where vacuum treatment of the held object (5) is performed.

Description

technical field [0001] The present invention relates to a holding device capable of holding an object to be held by an adhesive sheet and moving it in a vacuum environment, and a vacuum processing device for vacuum processing the object held on the holding device. Background technique [0002] In the manufacturing process of flat panel displays such as liquid crystal displays (LCDs) and plasma displays (PDPs), there is a technique of using an adhesive chuck device to hold a substrate including a substrate assembly process and a substrate transfer process. [0003] For example, in the apparatus described in Japanese Patent No. 3882004, a substrate transferred by a substrate transfer robot is pressed against an adhesive member disposed on a holding plate with a predetermined pressure, and the substrate is held by the adhesive force of the adhesive member. There is also described a technique for stronger suction holding by vacuuming the concave portion surrounded by the adhered...

AI Technical Summary

Problems solved by technology

[0005] However, in the suction holding described in this publication, if the adhesive pad and the substrate are bonded in a state that does not reach a sufficient degree of vacuum, air may be bitten when the adhesive member and the substrate are bonded together. Problem, since the adhesive force depends on the contact area between the substrate and the adhered part, if air is bitten, the contact area decreases, the adhesive force decreases, and the substrate may fall

[0006] In addition, there is no pressure difference and no pressing force at the part where the adhesive pad and the substrate are in close contact. Therefore, in order to ensure a strong pressing force, it is necessary to make the space between the adhesive pads large, which may be caused by pressure. The substrate is deformed, or the size of the device is required

[0007] In addition, the adhesive pad disposed on the deformable film is pressed toward the substrate by generating a pressure difference between the concave portion and the closed space separated by the deformable film, but depending on the pressure distribution at the junction of the deformable film and the adhesive pad, There is a possibility that the adhesive surface of the adhesive pad is deformed and a strong adhesion to the substrate cannot be obtained

[0008] In addition, there is a problem that the surface of the substrate (film formation surface) opposite to the side where the substrate and the adhesive member are attached comes into contact with the parts of the substrate transfer robot and particles are generated

However, since the porous area is smaller than the adsorption surface of the elastic porous sheet, there is a problem that the heavy substrate cannot be lifted due to the decrease of the negative pressure acting on the substrate.

In addition, in the method using the elastic porous sheet, there is a problem that it cannot be used in a vacuum

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