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Automatic tin adding device and method and application of device

An automatic and automatic valve technology, applied in the direction of cells, electrolysis process, electrolysis components, etc., can solve the problems of long time to stop melting tin, long loading time, high start and stop frequency, etc., to avoid the increase of control difficulty and avoid tin sludge. large amount of effect

Active Publication Date: 2015-12-09
WISDRI ENG & RES INC LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] (2) When loading tin particles, it is necessary to stop dissolving tin; the amount of tin particles loaded at a time is large, the loading time is long, and the time to stop dissolving tin is long. 2+ Concentration fluctuates greatly
[0012] (1) The stop frequency of tin-dissolving cycle increases, and the difficulty of automatic control of tin ion concentration increases
[0013] (2) The start-stop frequency of the tin-melting cycle increases, and the corresponding equipment includes booster pumps, self-circulation pumps, and related automatic valves. The start-stop frequency increases, and the life of the equipment decreases
[0014] (3) During the start-stop process of the system, the tin-dissolving reaction is in an unstable state, the frequency of start-stop is too high, and the ratio of unstable tin-dissolving to the tin-dissolving reaction increases, which is also easy to cause SnO 2 side effects

Method used

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  • Automatic tin adding device and method and application of device
  • Automatic tin adding device and method and application of device
  • Automatic tin adding device and method and application of device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] In order to overcome the large amount of tin sludge caused by adding tin in a single batch in the existing tin adding device, the Sn 2+ Concentration fluctuations are large, and frequent start-stop tin-dissolving cycles lead to increased difficulty in controlling the concentration of tin ions, instability of start-stop dissolving tin, and large equipment loss. This embodiment provides a method such as figure 1 The automatic tin adding device shown includes a tin adding buffer tank 2 and a hopper 4, the tin adding buffer tank 2 is installed on the upper part of the tin dissolving tank 1, and a valve plate is arranged between the tin adding buffer tank 2 and the tin dissolving tank 1 3. The upper part of the tinning buffer tank 2 is connected to the hopper 4 through a pipeline 7, the pipeline 7 is provided with an automatic valve 6, and the tinning buffer tank 2 is provided with an overflow port 5.

[0043] And in order to add the amount of tin particle 11 in the tin buff...

Embodiment 2

[0054] On the basis of Example 1, such as figure 2 As shown, this embodiment provides an electroplating tin dissolving system applying the automatic tin adding device of the present invention, including the automatic tin adding device and the electroplating circulation tank 19 in the above-mentioned embodiment 1, and the top of the tin dissolving tank 1 passes through the first An overflow pipe is connected with the liquid inlet of the electroplating circulation tank 19, and the first overflow pipe is provided with an automatic valve 3 14, and the liquid outlet of the electroplating circulation tank 19 is connected with the bottom of the tin dissolving tank 1 through the pump 9, so that The pipeline between the pump 9 and the tin dissolving tank 1 is provided with an oxygen injection port 10, and the outlet of the pump 9 is provided with a bypass pipeline connected with the tin buffer tank 2, and the bypass pipeline is provided with an automatic valve 415, The overflow port 5...

Embodiment 3

[0063] On the basis of Example 1, such as image 3 As shown, the present embodiment provides a tin dissolving system for electroplating using the automatic tin adding device of the present invention, the top of the tin dissolving tank 1 is connected to the liquid inlet of the electroplating circulation tank 19 through a first overflow pipe, and the first The overflow pipeline is provided with automatic valve 3 14 and pressure gauge 3 17, and the liquid outlet of the electroplating circulation tank 19 is connected with the bottom of the tin dissolving tank 1 through the pump 9, and the pipeline between the pump 9 and the tin dissolving tank 1 Oxygen injection port 10 is arranged on it, and described overflow port 5 links to each other with electroplating circulation tank 19 through the second overflow pipe, and this second overflow pipe is provided with automatic valve two 13, and described tin dissolving tank 1 is provided with A pressure gauge 12, the valve plate 3 is connect...

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PUM

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Abstract

The invention provides an automatic tin adding device. The device comprises a tin adding buffering tank and a hopper, wherein the tin adding buffering tank is mounted at the upper part of a tin dissolving tank; a valve plate is arranged between the tin adding buffering tank and the tin dissolving tank; the upper part of the tin adding buffering tank is connected with the hopper through a pipeline; a first automatic valve is arranged on the pipeline; an overflowing opening is formed in the tin adding buffering tank. The invention further provides a tin adding method of the automatic tin adding device. The automatic tin adding method and the automatic tin adding device are combined to enable that the tin can be directly quantitatively added at small batch into a high-pressure sealed liquid vessel under the atmosphere environment without stopping dissolving, so that the problems of big quantity of tin slimes and big fluctuation of concentration of Sn<2+> caused by adding tin at large batch each time in the existing method, and big difficulty in control of the concentration of tin ions, unstable starting and stopping of dissolving of tin and large equipment consumption caused by frequently starting and stopping the recycling of tin dissolving, can be avoided.

Description

technical field [0001] The invention relates to a tin adding device, in particular to an automatic tin adding device to a high-pressure airtight liquid tank, a tin adding method thereof, and an electroplating tin dissolving system using the automatic tin adding device. Background technique [0002] Electroplated tinplate is widely used in metal packaging, and the production methods of commodity electroplated tinplate include soluble anode method and insoluble anode method. The use of insoluble anodes to produce electroplating tin can obtain better coating quality, thinner coatings, better production environments and more flexible operating systems; however, the production of electroplating tin with insoluble anodes requires the configuration of an off-line dissolving tin system to supplement electroplating The Sn consumed continuously in the process 2+ . [0003] The tin dissolving system consists of tin dissolving tanks, corresponding pumps, valves, detection elements, an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D21/14C25D3/30
Inventor 蔡玲贺立红
Owner WISDRI ENG & RES INC LTD