A kind of automatic tin adding device and its tin adding method and application
An automatic and automatic valve technology, applied in the direction of cells, electrolytic process, electrolytic components, etc., can solve the problems of long time to stop dissolving tin, increased frequency of automatic valve start and stop, and shortened equipment life, so as to avoid large amount of tin sludge, Avoid the effect of increased difficulty of control
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Embodiment 1
[0042] In order to overcome the large amount of tin sludge caused by adding tin in a single batch in the existing tin adding device, the Sn 2+ Concentration fluctuations are large, and frequent start-stop tin-dissolving cycles lead to increased difficulty in controlling the concentration of tin ions, instability of start-stop dissolving tin, and large equipment loss. This embodiment provides a method such as figure 1 The automatic tin adding device shown includes a tin adding buffer tank 2 and a hopper 4, the tin adding buffer tank 2 is installed on the upper part of the tin dissolving tank 1, and a valve plate is arranged between the tin adding buffer tank 2 and the tin dissolving tank 1 3. The upper part of the tinning buffer tank 2 is connected to the hopper 4 through a pipeline 7, the pipeline 7 is provided with an automatic valve 6, and the tinning buffer tank 2 is provided with an overflow port 5.
[0043] And in order to add the amount of tin particle 11 in the tin buff...
Embodiment 2
[0054] On the basis of Example 1, such as figure 2 As shown, this embodiment provides an electroplating tin dissolving system applying the automatic tin adding device of the present invention, including the automatic tin adding device and the electroplating circulation tank 19 in the above-mentioned embodiment 1, and the top of the tin dissolving tank 1 passes through the first An overflow pipe is connected with the liquid inlet of the electroplating circulation tank 19, and the first overflow pipe is provided with an automatic valve 3 14, and the liquid outlet of the electroplating circulation tank 19 is connected with the bottom of the tin dissolving tank 1 through the pump 9, so that The pipeline between the pump 9 and the tin dissolving tank 1 is provided with an oxygen injection port 10, and the outlet of the pump 9 is provided with a bypass pipeline connected with the tin buffer tank 2, and the bypass pipeline is provided with an automatic valve 415, The overflow port 5...
Embodiment 3
[0063] On the basis of Example 1, such as image 3 As shown, the present embodiment provides a tin dissolving system for electroplating using the automatic tin adding device of the present invention, the top of the tin dissolving tank 1 is connected to the liquid inlet of the electroplating circulation tank 19 through a first overflow pipe, and the first The overflow pipeline is provided with automatic valve 3 14 and pressure gauge 3 17, and the liquid outlet of the electroplating circulation tank 19 is connected with the bottom of the tin dissolving tank 1 through the pump 9, and the pipeline between the pump 9 and the tin dissolving tank 1 Oxygen injection port 10 is arranged on it, and described overflow port 5 links to each other with electroplating circulation tank 19 through the second overflow pipe, and this second overflow pipe is provided with automatic valve two 13, and described tin dissolving tank 1 is provided with A pressure gauge 12, the valve plate 3 is connect...
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