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Gong board mold and gong board method of pcb board

A kind of PCB board, gong board technology, applied in electrical components, printed circuit manufacturing, printed circuit and other directions, can solve the problems of no positioning hole, no board edge, inaccurate gong board, etc., to achieve the effect of improving the pass rate and accurate positioning

Active Publication Date: 2018-05-18
东莞市五株电子科技有限公司
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  • Claims
  • Application Information

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Problems solved by technology

[0006] In order to solve the problem that the fixed mold of multiple PCB boards has no board edges and no positioning holes, and cannot accurately press the board to improve the utilization rate of typesetting, the present invention provides a method for performing board board on a single PCB board with high precision. Gong board mold and PCB board method

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  • Gong board mold and gong board method of pcb board
  • Gong board mold and gong board method of pcb board
  • Gong board mold and gong board method of pcb board

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Embodiment Construction

[0023] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0024] refer to figure 1 , is a structural schematic diagram of the PCB board after the first gong board is completed in the gong board method provided by the present invention. The PCB board 1 includes a long through slot 11 , a body portion 12 , a connecting portion 13 , a crafted edge 14 and a positioning hole 15 .

[0025] Specifically, the PCB board 1 is a rectangular board body. The long through groove 11 is opened at both ends of the PCB board, which separates the main body part 12 , the connecting part 13 and the crafting edge 14 of the PCB board 1 . Wherein the body part 12 is the middle part of the PCB board 1 , and the process forming edge 14 is the two ends of the PCB board 1 .

[0026] The connection part 13 connects the body part 12 and the process forming edge 14 . The number of the positioning holes 15 is four, and the positioning ho...

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Abstract

The invention provides a board milling mold which is used for milling a PCB. The PCB is provided with long through slots near the edges, and the long through slots divide the PCB into a body part, connection parts and process molding edges, wherein the connection parts connect the body part and the process molding edges. The board milling mold comprises a bottom plate, a concave module formed on the bottom plate, and convex ribs and board-milling hollowed-out areas which are arranged on the concave module. The convex ribs correspond to the long through slots of the PCB, and the board-milling hollowed-out areas are arranged at the two ends of the convex ribs and correspond to the connection parts of the PCB. Compared with related technologies, the board milling mold provided by the invention has a positioning module, so that the PCB can be accurately positioned in the board milling mold, and in the PCB milling process, the size of a molded PCB can be controlled within the tolerance range, and the qualification rate of finished products is improved. The invention further provides a PCB milling method.

Description

technical field [0001] The invention relates to the technical field of printed circuit board (Printing Circuit Board, PCB) manufacturing, in particular to a gong board mold and a gong board method for a PCB board. Background technique [0002] With the development of electronic technology, PCB boards have replaced the connection methods of traditional electronic components and are widely used in electronic products. The gong board of the PCB board is an important process in the PCB board manufacturing process. The PCB board is cut according to the graphics required by the customer through the processing program of the engineering design. [0003] At present, in the PCB board processing industry, in order to facilitate large-scale production, it is often necessary to manufacture a whole PCB board containing multiple PCB boards first, and then process the shape of the whole PCB board to form multiple PCB boards. [0004] In the process of gong board, in order to ensure the di...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
CPCH05K3/0044H05K2203/0228
Inventor 孟昭光叶志蔡志浩
Owner 东莞市五株电子科技有限公司
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