A method of making characters on pcb thick copper plate

Abstract

The invention relates to the technical field of circuit board production, in particular to a method for making characters on a PCB thick copper board. The present invention avoids the situation that a single character is partly located on the substrate surface and partly located on the copper surface by separately designing the screen plates for the substrate surface and the copper surface, and screen-prints the characters on the substrate surface and the copper surface respectively in two times to solve the problem of In the conventional design, due to the large step height between the copper surface and the substrate surface, there is a problem of no ink on the substrate near the copper surface; and through two silk screen printings, it can also avoid excessive pressure on the copper surface caused by one screen printing, or one time If the screen printing pressure is too small, the base material surface will not be oily; thus, clear characters can be produced on the thick copper plate of the PCB, and the appearance quality of the product can be improved. At the same time, the present invention cooperates with specific screen printing and screen printing parameters to ensure the quality of silk screen printing and the quality of characters.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a method for making characters on a PCB thick copper board. Background technique [0002] According to different design requirements, the copper layer thickness (copper surface thickness) of the outer layer circuit on the PCB will be different. Some PCBs require the copper layer thickness of the outer layer circuit to be ≥ 70 μm. This type of PCB is called PCB thick copper plate. The existing PCB production process is generally to make the outer layer circuit on the multi-layer board, then make the solder mask on the surface of the multi-layer board, and then make the characters in a certain area, as follows: Multilayer board→screen printing solder mask ink→pre-baking→alignment exposure→development→QC board inspection→screen printing character ink→curing→QC board inspection→post-process. In the production process of PCB thick copper plate, due to the large heigh...

AI Technical Summary

Problems solved by technology

[0003] The present invention aims at the problem that the characters on the base material near the copper surface tend to be unclear when making characters on the PCB thick copper plate in the prior art, and provides a character making method that can prevent the characters from being unclear on the PCB thick copper plate

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