Chip electronic component and board having the same
An electronic component and chip technology, which is applied in the direction of printed circuits connected with non-printed electrical components, electrical components, transformer/inductor parts, etc., can solve the problems of internal core area reduction and miniaturization limitations
Active Publication Date: 2016-04-20
SAMSUNG ELECTRO MECHANICS CO LTD
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Problems solved by technology
[0010] Via electrodes and conductive coil patterns are usually arranged in a straight line, and relatively large pads are formed to prevent defects due to misalignment of via parts, causing problems in the manufacture of inductors with small size and high inductance
[0011] In addition, since the pad can be placed adjacent to the core forming the inductor, the internal core area will be reduced, thereby placing a large limit on miniaturization
Method used
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[0024] Exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings.
[0025] However, this disclosure may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
[0026] In the drawings, the shapes and dimensions of elements may be exaggerated for clarity, and the same reference numerals will be used throughout to designate the same or like elements.
[0027] chip electronic components
[0028] Hereinafter, a chip type electronic component according to an exemplary embodiment of the present disclosure will be described. Specifically, a thin film inductor will be described, but the present disclosure is not limited thereto.
[0029] figure 1 is a schematic perspective view showing a ...
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Abstract
A chip electronic component and a board having the same are provided. The chip electronic component includes: a substrate; a first internal coil part disposed on one surface of the substrate; a second internal coil part disposed on the other surface of the substrate opposing one surface thereof; a via penetrating through the substrate to connect the first and second internal coil parts to each other; and first and second via pads disposed on one surface and the other surface of the substrate, respectively, to cover the via, wherein the first and second via pads are extended in a direction toward portions of the first and second internal coil parts adjacent thereto.
Description
[0001] This application claims priority and benefit from Korean Patent Application No. 10-2014-0138590 filed in the Korean Intellectual Property Office on October 14, 2014, the disclosure of which is hereby incorporated by reference. technical field [0002] The present disclosure relates to a chip type electronic component and a board having the chip type electronic component. Background technique [0003] Inductors, which are chip electronic components, are representative passive components that constitute electronic circuits together with resistors and capacitors to remove noise. Such inductors and capacitors are generally combined in consideration of their respective electromagnetic characteristics to constitute a resonance circuit, a filter circuit, and the like that amplify a signal of a specific frequency band. [0004] Recently, as information technology (IT) devices such as communication devices, display devices, etc. have become thinner and miniaturized, various el...
Claims
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IPC IPC(8): H01F17/04H01F27/30H05K1/18
CPCH01F17/06H01F27/292H01F2017/048H01F17/0013H01F17/0006H01F2017/0073
Inventor 郑东晋
Owner SAMSUNG ELECTRO MECHANICS CO LTD