Hermetic conductive feedthroughs for semiconductor wafer

Abstract

A glass wafer has an internal surface and an opposing external surface separated by a wafer thickness. A hermetic, electrically conductive feedthrough extends through the wafer from the internal surface to the opposing external surface. The feedthrough includes a feedthrough member having an inner face exposed along the internal surface for electrically coupling to an electrical circuit. The feedthrough member extends from the inner face partially through the wafer thickness to an exteriorly-facing outer face hermetically embedded within the wafer.

Description

technical field [0001] The present disclosure relates to devices with hermetic electrical feedthroughs in glass wafers. Background technique [0002] An electrical feedthrough provides a conductive path extending from the inside of a sealed enclosure or housing to a point outside the enclosure. The conductive path through the feedthrough includes a conductor pin, wire, or other conductive member or material that is electrically insulated from the container if the container is formed of a conductive material. For example, a conductive feedthrough in an implantable medical device (IMD) provides a conductive path from a connection point to electronic circuitry contained within the IMD housing or housing to a point outside the housing. The feedthrough member is sealed to the housing to prevent the ingress of blood or other bodily fluids that could damage the IMD's internal circuitry and cause the device to malfunction or malfunction. The junction between the housing and the co...

AI Technical Summary

Problems solved by technology

As size decreases, feedthrough component options become limited due to small size requirements and manufacturability of hermetic feedthroughs becomes more challenging

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