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Substrate Holding Assistant Member And Substrate Transfer Apparatus

A technology for auxiliary components and substrate transportation, which is applied in the direction of conveyor objects, transportation and packaging, electrical components, etc. It can solve the problems of wafer warpage and enlargement, and achieve the effect of reliable vacuum adsorption

Inactive Publication Date: 2016-07-06
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in recent years, the warpage of wafers has increased due to the thinning of wafers, the increase in the density of semiconductor devices formed on wafers, and the complexity of structures.

Method used

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  • Substrate Holding Assistant Member And Substrate Transfer Apparatus
  • Substrate Holding Assistant Member And Substrate Transfer Apparatus
  • Substrate Holding Assistant Member And Substrate Transfer Apparatus

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0035] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In this embodiment mode, a probe for inspecting electrical characteristics of a semiconductor device formed on a wafer as a substrate to be processed is cited as the substrate processing apparatus of the present invention.

[0036] figure 1 It is a perspective view showing a schematic configuration of the detector. The prober 10 includes: a main body 12 in which a stage 11 (mounting table) for placing a wafer W is built; a loading unit 13 arranged adjacent to the main body 12; and a test head 14 (inspection unit). part), the test head 14 (inspection part) is arranged to cover the main body 12, and the prober 10 is used to test semiconductor devices formed on a wafer W with a diameter of 300mm (φ300mm) or 450mm (φ450mm) The electrical characteristics are checked.

[0037] The main body 12 is in the shape of a hollow shell. An opening 12 b opening above the w...

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PUM

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Abstract

A substrate holding assistant member for assisting vacuum-suction of a substrate on a mounting table includes an upper covering wall portion and a side surrounding wall portion. The upper covering wall portion has intake holes or gas ejection holes for ejecting a gas toward the substrate and is configured to cover a space above the substrate mounted on the mounting table. The side surrounding wall portion is coupled to an outer peripheral portion of the upper covering wall portion and configured to cover a side of the substrate. A gap between an inner peripheral surface of the side surrounding wall portion and an outer peripheral side surface of the substrate is smaller than a gap between an uppermost portion of the substrate and a bottom surface of the upper covering wall portion.

Description

technical field [0001] The present invention relates to a substrate adsorption assisting member and a substrate transfer device used when a substrate such as a semiconductor wafer is to be adsorbed and held on a mounting table for testing or processing the substrate such as the semiconductor wafer. Background technique [0002] A probe device (hereinafter referred to as a "probe") is known as a device for inspecting electrical characteristics of semiconductor devices formed on a semiconductor wafer (hereinafter referred to as a "wafer") as an example of a substrate. As an example of a prober, there is known a prober that includes a probe card having a predetermined number of probes for contacting one semiconductor device among a plurality of semiconductor devices formed on a wafer. pins; and a stage for placing a wafer, the stage moves freely in the up, down, left, and right directions, and the inspection current is controlled by bringing the probes into contact with the ele...

Claims

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Application Information

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IPC IPC(8): H01L21/683H01L21/677
CPCH01L21/67288H01L21/6838H01L21/677H01L2221/683
Inventor 带金正
Owner TOKYO ELECTRON LTD