Mounting device, load measuring method and program thereof
A technology of an installation device and a detection method, applied in the direction of electrical components, electrical components, etc., can solve the problems such as the inability to calculate the pressing load with high precision, and the inability to detect the shrinkage of the coil spring.
Active Publication Date: 2016-07-27
JUKI CORP
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Problems solved by technology
However, in reality, the actual shrinkage of the coil spring cannot be detected due to the warpage of the substrate or the deflection caused by the mounted load, and the press-fit load for the component cannot be calculated with high accuracy.
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[0040] Next, the mounting device according to this embodiment will be described with reference to the drawings. figure 1 It is a schematic plan view of the mounting device according to this embodiment. figure 2 It is an explanatory diagram of the detection operation of the press-fitting load related to the comparative example. In addition, the mounting device according to this embodiment is not limited to figure 1 The shown structure can be changed suitably.
[0041] Such as figure 1 As shown in FIG. figure 2 ) is pressed into the substrate W by the suction head 31 to carry out mounting. In the approximate center of the base 11 of the mounting apparatus 1 , a substrate transfer unit 12 is arranged along the X-axis direction. The substrate transport unit 12 transports and positions the substrate W before component mounting to a predetermined position from one end side in the X-axis direction, and unloads the substrate W after component mounting from the other end side in...
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The invention relates to a mounting device, a load measuring method and a program thereof. The indentation load of setting components on a base plate is high-precisely measured without using a force sensor. The load measuring method adopts the mounting device (1) to make a spiral spring (39) arranged on a suction nozzle (35) to contract for one side, and on the other side, the indentation load from a needle to the component is measured when a component (P) absorbed by the suction nozzle is pressed on the base plate (W); the load measuring method comprises the following steps: the suction nozzle is made to move to the target control position, the component is pressed, the suction nozzle is shot at the target control position (Hb) so that a shooting image is generated, the recognition position (Ha) of the suction nozzle in the shooting image is changed to the current position (Hc) of the suction nozzle, according to a difference value of the target control position and the suction nozzle curret position, the contraction amount of the spiral spring is calculated, and based on the above, the indentation load of the component can be calculated.
Description
technical field [0001] The present invention relates to a mounting device for mounting a component on a substrate using a suction head, a load detection method, and a program thereof. Background technique [0002] The suction head of the mounting device uses a suction nozzle with a coil spring, and while contracting the coil spring, presses the component sucked by the suction nozzle into the substrate to mount the component on the substrate. As such a suction head, the suction head which detects the press-fit load with respect to a component is known (for example, refer patent document 1, 2). The suction head of Patent Document 1 is equipped with a load cell, and the reaction force that the suction nozzle receives from the component when the component is pushed in is detected by the load cell as a push-in load. The suction head of Patent Document 2 detects the contraction amount of the coil spring when the component is pushed in, and calculates the pushing load on the compo...
Claims
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IPC IPC(8): H05K13/08H05K13/04
CPCH05K13/0408H05K13/08
Inventor 井桝孝彦
Owner JUKI CORP