A device for disassembling a dual in-line package chip

Abstract

The invention relates to a dual-in-line package chip dismounting device which can solve the problem that a dual-in-line package chip is difficult to dismount rapidly in a lossless manner during maintenance of a circuit board. The dual-in-line package chip dismounting device includes a circuit board fixing unit (1), a molten tin bath unit (2), a heating temperature-control unit (3), a positioning unit (4), an operation display unit (5) and frames (6, 7, 9, 10). The dual-in-line package chip dismounting device is easy to operate, can rapidly dismount dual-in-line package chips with different pins from the circuit board in a lossless manner.

Description

technical field [0001] The invention relates to a device that can be used to remove a dual in-line package chip from a circuit board. Background technique [0002] With the rapid development of microelectronics technology, there are many applications and types of dual in-line package chips in modern weaponry. When a chip is damaged, it needs to be removed from the circuit board for testing or replacement for repair. Dual-in-line package chips usually have many pins and a large span. When disassembling, it is usually necessary to heat and melt the solder of all pins on the chip at the same time. At present, there is no suitable tool device. One method is to manually disassemble with an electric soldering iron. It is difficult to melt the solder on all pins at the same time and take out the chip. It usually needs to be repeated many times to remove some pins in stages, which will easily cause deformation of the circuit board and solder joints. fall off, making subsequent mai...

AI Technical Summary

Problems solved by technology

One method is to manually disassemble with an electric soldering iron. It is difficult to melt the solder on all pins at the same time and take out the chip. It usually needs to be repeated many times to remove some pins in stages, which will easily cause deformation of the circuit board and solder joints. fall off, making subsequent maintenance operations very difficult

Another common method is to use a tin furnace. The heating surface of the tin furnace is large, and all the pins of the chip can be melted and removed at the same time. However, large-area heating can easily cause damage to the chip to be disassembled due to excessive heat, and it is easy to treat. Demolition of components and circuit boards around the chip causes irreparable damage

This process not only needs to fix the circuit board to be repaired, but also needs to operate the electric soldering iron, and use the chip puller to remove the chip to be removed. The operation process is very complicated, and the connection should be very tight to disassemble successfully.

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