42 results about "Dual in-line package" patented technology

The invention relates to a novel wireless elevator door machine control system, which realizes wireless control over an elevator door machine by using embedded software and hardware. The wireless elevator door machine control system comprises a wireless elevator door machine controller, a wireless elevator door machine operator and a wireless door machine embedded software module which is arranged on the wireless elevator door machine controller and the wireless elevator door machine operator, wherein the wireless door machine embedded software module which is arranged on the wireless elevator door machine controller and the wireless elevator door machine operator comprises a micro controller module, an input command processing module, a current sampling module, a moment detection module,a dual in-line package (DIP) state selection input module and the like. By the novel wireless elevator door machine control system, operational parameters of the elevator door machine controller can be set wirelessly, the influence of data lines can be eliminated, site operation is more flexible, and the work efficiency of installation and debugging personnel is higher. After the door machine controller fails, an operator liquid crystal display matched with the door machine controller can be used for reading false codes, and faults can be more intuitively and efficiently eliminated.

The invention relates to a multi-chip 3D stacked packaging structure. The structure comprises a main chip and at least one auxiliary chip. The main chip and the auxiliary chip are respectively provided with a circuit surface and a back surface facing the circuit surface; the auxiliary chip is stacked on the main chip; a main bonding pad is arranged on the circuit surface of the main chip, and an auxiliary bonding pad is arranged on the circuit surface of the auxiliary chip; the auxiliary bonding pad is connected with the main bonding pad by a metal wire. By using the multi-chip 3D stacked packaging structure, the main chip for video processing is designed to connect a plurality of auxiliary chips completely by internal leads in a package, and the functional integration of three chips in a dual in-line package is finished. High formation degree of the chip reduces the area of a circuit board, lowers the production cost of manufacturers, reduces the signal transmission delay and improves the system performance simultaneously. And the system board and the module have the advantages of small packaging size and light weight.

The invention discloses a pin trimming device based on recycled DIP (dual in-line package) type IC (integrated circuit) chip. The pin trimming device is characterized by comprising a pin coplane trimming unit, a pin tooth root trimming unit, a pin prong trimming unit and a pin finishing unit. Based on the device disclosed by the invention, the DIP type IC chip can be efficiently, accurately, economically and practically recycled through the pin coplane trimming, the pin tooth root trimming, the pin prong trimming and the pin finishing in sequence.

The invention discloses a circuit board debugging device and method, comprising a fixed needle socket and an active needle socket, where the fixed pin socket is in the bottom layer and welded to a printed circuit board (PCB), and the active needle socket is plugged in the fixed needle socket and provided with extractable needles, and the jacks on the extractable needles are used for DIP integrated circuit (IC) chips to be inserted in. As measuring, the pins of the extractable needles are suspended and do no contact with the fixed needle socket so that the circuit is cut-off; therefore the invention has no destruction to IC chips and PCBs, thus improving the circuit board debugging effect. And it can accurately locate failures and besides, the suspended pins are easy for fixing the probes of oscillographs and logic analyzers, beneficial to measurement.

A heat sink for dissipation heat for an electronic components (50) having a dual-in-line package comprises at least two fin units (20, 30, 40). Each of the fin units comprises a base (21, 31, 41) and a plurality of heat dissipation fins (23, 33, 43) extending upwardly from the base. At least one fixing hole (2314, 3314) is formed in one of the fin units. At least one fixing poles (3313, 4313) is formed in another neighboring fin unit. The two neighboring fin units are assembled together with the at least one fixing pole inserted in the at least one fixing hole. A receiving space is defined between the two neighboring fin units for receiving the electronic component therein.

The invention discloses a temperature-protection built-in integrated direct-current motor driving circuit for a toy, relates to a circuit structure, and in particular to a driving circuit structure for the toy. The temperature-protection built-in integrated direct-current motor driving circuit comprises a controller and an integrated direct-current motor driving circuit, wherein two signals of input ends of the integrated direct-more driving circuit are connected with an output end of the controller; output ends of the integrated direct-current motor driving circuit are respectively connected with two ends of a direct-current motor; a power switch is embedded in the integrated direct-current motor driving circuit; a single circuit can directly drive a direct-current motor to realize forward rotation, reverse rotation, brake and rotation stop of the direct-current motor; and a temperature protection circuit is arranged on the integrated direct-current motor driving circuit. The temperature-protection built-in integrated direct-current motor driving circuit solves the safety problem about motor stalling of the toy due to the fact that an existing driving circuit technology does not have protection function. The temperature-protection built-in integrated direct-current motor driving circuit is packaged by small size package like DIP8 (dual in-line package 8) or SOP8 (small outline package 8), so that the problem that total cost is high since separation elements are utilized in an existing driving circuit technology, welding points are large in number, and welding cost is close to a component is solved.

The invention relates to a multipurpose fixture for a bonder worktable, which is characterized in that a fixture body is provided with a chute, in which a slide bar is inserted; a hold-down spring is sheathed into the slide bar, and a hold-down spring stopper is sheathed into the slide bar; a hold-down spring handle is sheathed into the slide bar and is tightened. According to different types and spans of components, the fixture body is provided with different first fixing grooves, second fixing grooves, third fixing grooves and fourth fixing grooves. The fixture body is provided with an adjustable locating block and a location distance regulation orifice. The fixture body is equipped with a first upper hypotenuse clamping squash and a second upper hypotenuse clamping squash. The multipurpose fixture can fix various ceramic dual-in-line package components, various leadless components and various pin grid array components with different spans; the fixture can meet the clamping and fixing requirements in packaging and bonding without component damage or lead deformation in clamping and fixing.

Disclosed herein is a transmission/reception channel matching apparatus for a mobile communication terminal and a mobile phone test equipment. The transmission/reception channel matching apparatus includes a Printed Circuit Board (PCB), a Dual In-line Package (DIP) switch, and a fastening casing. The PCB includes mobile communication terminal-side terminals to be electrically connected to option pins provided in the serial communication connector of the mobile communication terminal, and transmission and reception terminals corresponding to the transmission and reception channels of the mobile phone test equipment for transmitting a transmission signal to the mobile communication terminal and receiving a reception signal from the mobile communication terminal. The DIP switch is provided with a plurality of switches, is combined with the PCB, and selectively connects the mobile communication terminal-side terminals to the transmission and reception terminals depending on ON/OFF information. The fastening casing accommodates the PCB so that part of the DIP switch is exposed to the outside.

The invention discloses a thermoplastic tube mounting mechanism for an automatic buzzer assembly line. The thermoplastic tube mounting mechanism for the automatic buzzer assembly line comprises a thermoplastic tube, a reel, a reel carrier, a support, a vertical plate, a slide plate, a lifting cylinder, a thermoplastic tube guide device and a heat shrinkable tube shearing device. The thermoplastic tube is wound on the reel which is rotatably connected with the top of the reel carrier. Both the reel carrier and the support are fixed on a bench. The vertical plate is fixed on the support. The slide plate is perpendicularly and slidably connected with the vertical plate. A cylinder block of the lifting cylinder is fixed on the vertical plate. A piston rod of the lifting cylinder is fixed on the slide plate. Both the thermoplastic tube guide device and the heat shrinkable tube shearing device are fixed on the slide plate. The heat shrinkable tube shearing device is located below the thermoplastic tube guide device. The thermoplastic tube mounting mechanism allows for automatic mounting of buzzer DIP (dual in-line package) thermoplastic tubes, labor resources are saved greatly, and work efficiency is improved.

A main board and a computer apparatus having the main board are provided. The main board includes a printed circuit board (PCB), a first connector, and a second connector. The PCB is configured for being electrically connected to a processor. The first connector is electrically connected to the PCB in a dual in-line package (DIP) manner, and is configured for a memory to be mounted to the first connector. The second connector is electrically connected to the PCB in a surface mount technology (SMT) manner, and is configured for the memory to be mounted to the second connector. Accordingly, transmission performance of memory signals may be improved.

The invention relates to a DIP (dual in-line package) component electrostatic protector. The electrostatic protector comprises a shell, wherein the shell is provided with a groove, the width of a body is greater than that of the groove, the length of a terminal pin is less than the depth of the groove, the groove of the shell is internally provided with a bulge, the hole between the bulge and the side wall of the groove and the terminal pin are in interference fit with each other, and the contact part of the bulge and the terminal pin can conduct electricity. The DIP component electrostatic protector provided by the invention has the advantages that a DIP terminal pin structure is utilized, so that static breakdown caused by welding friction, induction and the like before the component is connected with an electronic circuit and then powered on can be fundamentally and completely eradicated, and the storage, transportation, operation, use and the like of the component can be carried out conveniently. The electrostatic protector has no special requirement on welding tools and workshop environment, can be used repeatedly and has a good practical effect.

The invention relates to a LED technique, as one multifunctional LED support, wherein it has one main support with one plane part and at least one couple of pins extending downwards from the plane part, and at least one couple of pins at two sides of main support; and said all pins are alternated into two rows; the main support carries the LED chip and emits the heat generate by working LED on time, and selectively supplies electric connection of LED chip and supplies enough wire positions; the pins at two sides of main support can meet different electric connections of multi chip LED; and the pins are in two rows, therefore, the packed LED can use two row plug packed DIP (Dual In-line Package), to form tube.

The invention discloses a dual in-line package (DIP) LED (Light Emitting Diode) automatic forming device capable of positioning height and a DIP LED automatic forming method. The device comprises DIP LED bodies and height positioning rubber bars which are fixedly connected to two pins of each DIP LED body, wherein the bottom surfaces of all the height positioning rubber bars are planes and are located on the same plane vertical to the pins; the method comprises the steps of applying bonding force on the DIP LED bodies on opposite braids of the upper and lower height positioning rubber bars; reliably bonding the upper and lower height positioning rubber bars on the front faces and back faces of all the DIP LED bodies on the braids; and finally punching the positions of the upper and lower height positioning rubber bars between two adjacent DIP LED bodies on the braids to form each DIP LED capable of positioning height. Automatic plugging can be completed through an automatic plug-in device in the way that the height positioning rubber bars on the pins of the DIP LED bodies, an original braiding mode is not needed to be changed, and no influence is caused on the element performance.

The present invention discloses an industrial control intelligent gateway, and relates to the technical field of intelligent gateways. A power module of a processing chip is electrically connected with a power module. An interface end of the processing chip is electrically connected with a plurality of USB interface assemblies. An output end of the processing chip is electrically connected with an indicator light assembly. An input end of the processing chip is electrically connected with a clock module. A storage end of the processing chip is electrically connected with a storage module. The processing chip is electrically connected with a dual in-line package switch, a crystal oscillation circuit and an Ethernet module separately. The storage end of the processing chip is connected with a sensing relay coil. The power module is connected with one end of a normally-closed contact of a sensing relay, and the other end of the normally-closed contact of the sensing relay is electrically connected with an alarm. The industrial control intelligent gateway disclosed by the present invention realizes real-time detection, ensures that the processing chip works normally, is easy to use and simple to operate, and has high efficiency.

The invention relates to a dual in-line package frame. The dual in-line package frame comprises a base island piece, a chip and an internal pin, wherein the base island piece is in a flat plate shape, the internal pin is connected to the base island piece, and the chip is arranged on the base island piece. An included angle exists between the internal pin and the flat plate face of the base island piece. The internal pin and the base island piece are integrally formed, and the aim of improving the heat dissipation effect is achieved.