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6 results about "Dual in-line package" patented technology
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In microelectronics, a dual in-line package (DIP or DIL), or dual in-line pin package (DIPP) is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board (PCB) or inserted in a socket. The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at Fairchild R&D in 1964, when the restricted number of leads available on circular transistor-style packages became a limitation in the use of integrated circuits. Increasingly complex circuits required more signal and power supply leads (as observed in Rent's rule); eventually microprocessors and similar complex devices required more leads than could be put on a DIP package, leading to development of higher-density chip carriers. Furthermore, square and rectangular packages made it easier to route printed-circuit traces beneath the packages.
Apparatus for utility control
ActiveUS20250218700A1Domestic stoves or rangesLighting and heating apparatusAC - Alternating currentLow voltage
An apparatus for utility control is provided. The apparatus for utility control may include a protective enclosure and a front cover. A start actuator and a stop actuator are mounted on the front cover. Pushing the start actuator starts two timers for an ignitor circuit and a valve. The timers may be configurable and controlled by one or more dual in-line package (DIP) switches. Pushing the stop actuator stops one or both of the ignitor circuit and the flow of fluid through the valve. The apparatus for utility control includes a power supply to convert high voltage alternating current (AC) to low voltage direct current (DC). One or more electrical components, including the power supply, are mounted to the front cover to allow for enhanced serviceability of the apparatus for utility control.
Owner:WCM IND INC
Dual in-line package defect image post-processing system combining bilayer occlusion perception and soft non-maximum suppression and method thereof
A dual in-line package defect image post-processing system combining bilayer occlusion perception and soft non-maximum suppression and a method thereof are disclosed. In the system, a bilayer convolutional network model models a defect region of a dual in-line package image as a top layer and a bottom layer overlapped with each other, detects an occlusion part and infers an occluded part to output masks and detection boxes. Each of the masks and the detection boxes is filtered based on an area size. A soft non-maximum suppression calculation is executed to output the detection box having high confidence and low intersection over union. A polygon approximation process is executed to obtain simplified polygonal masks. The simplified polygonal masks, the detection box having high confidence and low intersection over union, and the dual in-line package image are displayed, thereby achieving the technical effect of improving the flexibility and accuracy of defect inspection.
Owner:SQ TECH (SHANGHAI) CORP +1
Pin anti-damage protection structure for dual in-line packaging device
PendingCN121269217ARigid containersInternal fittingsScrew threadElectrical and Electronics engineering
The invention relates to the technical field of DIP device pin protection, in particular to a pin anti-damage protection structure for a dual-in-line packaging device, which comprises a frame and an adjusting unit, and is characterized in that the adjusting unit comprises two sliding rods, a bidirectional screw rod, two clamping plates, two plugging cabins, a rotating knob, a stabilizing assembly, a supporting assembly and a splicing assembly; during use, the rotary knob is rotated according to the size of a dual in-line packaging device, the bidirectional screw is driven to rotate, and the two clamping plates are driven to move away from each other or face to face along the sliding rods according to the principle that the screwing directions of threads are inconsistent, so that the distance between the two inserting bins is adjusted; and after being adjusted to a proper position, the pin is downwards put in to enable the pin to enter the plugging cabin, so that the adjustment of the sizes of different dual-in-line packaging devices is realized through the mode, a worker can conveniently use the frame to place the different dual-in-line packaging devices, the equipment cost is reduced, and the practicability and convenience of the frame are improved.
Owner:HUIZHOU JUNYA DIGITAL TECH CO LTD
System and method for railroad smart flasher lamps
A smart lamp system and method for monitoring a status of LEDs. The system can provide LED status monitoring using a logic controller communicating with at least one strip of LEDs. The system can utilize the logic controller to assign a unique identifier (ID) to the at least one strip of LEDs based on a physical position of a plurality of dual-inline package (DIP) switches incorporated within a smart lamp housing. The system can provide a hardware architecture to interface the logic controller with a power-line communication (PLC) transceiver. The system can establish a communication protocol between the PLC transceiver and a PLC receiver to efficiently communicate the statuses of the LEDs. The logic controller can generate a payload including a binary representation of the unique ID of the smart lamp and the statuses of the LEDs and transmit the payload to the PLC transceiver.
Owner:BNSF RAILWAY COMPANY
Electrical connector with multiple shielding spacers between two rows of terminals
ActiveUS12500384B2Soldered/welded conductive connectionsSecuring/insulating coupling contact membersSurface mountingElectrical connection
A composite mounting type electrical connector includes an insulating shell, a plurality of terminals and a plurality of shielding members. The terminals are arranged in two rows parallel to each other, and the shielding members are arranged between the two rows of terminals and separated from each other by a predetermined distance to form insulation. The two rows of terminals are soldered to a circuit board by surface mounting technology and dual in line package process respectively. The ground terminals in the two columns of terminals are commonly connected to a shield member to form a common ground structure. The power terminals in the two columns of terminals are commonly connected to another shielding member to form a parallel connecting structure.
Owner:DONGGUAN KANG XIANG ELECTRONICS CO LTD
An integrated circuit cutting and molding apparatus and a cutting method
The present application relates to the technical field of electronic device manufacturing, and particularly relates to an integrated circuit cutting forming device and a cutting method. The integrated circuit cutting forming device provided by the present application comprises a tool holder and at least one pair of knife blades opposite to each other; the knife blades are slidably connected to the tool holder, and the knife blades opposite to each other are relatively moved on the tool holder to make the opposite knife blades close to each other for cutting; the at least one pair of knife blades opposite to each other comprises a pair of first knife blades, the first knife blades are used for cutting the pins of the integrated circuit, and the tool holder is provided with positioning ribs between the pair of first knife blades. The dual-in-line package integrated circuit can be placed on the positioning ribs, so that the knife blades opposite to each other can cut the pins on both sides respectively, and the flat-structure integrated circuit can be placed between the first knife blades and the positioning ribs for cutting, thereby improving the applicability.
Owner:TIANSHUI TIANGUANG SEMICON