Multipurpose clamper for bonding machine worktable

A workbench and multi-purpose technology, applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as small adsorption force, insufficient clamping strength, failure, etc., to reduce design and processing, reduce production costs, The effect of improving productivity

Active Publication Date: 2008-11-12
WUXI ZHONGWEI GAOKE ELECTRONICS +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In actual use, there are the following problems: 1. Special fixtures for fixed components, structural components of different sizes must be processed and fixed special fixtures, and the bonding process is replaced with the change of varieties
For example: the clamp for fixing CDIP20 with a span of 7.62mm by vacuum adsorption cannot fix the CDIP20 with a span of 15.24mm; the clamp for fixing CDIP by vacuum adsorption cannot fix pin-grid array components; The device fixture cannot fix CDIP series, pin grid array, etc.
2. Insufficient clamping strength, especially when the flatness of the fixing surface of the component to be fixed is poor, rough, etc., there will be vacuum leakage, resulting in small adsorption force, weak fixation and poor bonding of the device or even failure

Method used

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  • Multipurpose clamper for bonding machine worktable
  • Multipurpose clamper for bonding machine worktable
  • Multipurpose clamper for bonding machine worktable

Examples

Experimental program
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Embodiment Construction

[0012] Below the present invention will be further described in conjunction with the embodiment in the accompanying drawing:

[0013] Such as figure 1 ~As shown in Figure 3, it includes the connection hole 1 of the bonding machine table, the fixing screw 2 of the bonding machine table, the first upper bevel clamping pressure piece 3, the fixing screw 4, and the second upper bevel clamping Pressing plate 5, fixing screw 6, first fixing groove 7, second fixing groove 8, third fixing groove 9, fourth fixing groove 10, fixing hole 11, fixing screw 12, compression spring 13, compression spring stopper Block 14, compression spring handle 15, spring handle locking screw 16, sliding rod 17, positioning distance adjustment hole 18, chute 19, adjustable positioning block 20, fixture loading positioning hole 21 and fixture body 22, etc.

[0014] The present invention mainly adopts that a chute 19 is provided on the fixture body 22 , and the chute 19 is used for sliding the sliding rod 1...

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Abstract

The invention relates to a multipurpose fixture for a bonder worktable, which is characterized in that a fixture body is provided with a chute, in which a slide bar is inserted; a hold-down spring is sheathed into the slide bar, and a hold-down spring stopper is sheathed into the slide bar; a hold-down spring handle is sheathed into the slide bar and is tightened. According to different types and spans of components, the fixture body is provided with different first fixing grooves, second fixing grooves, third fixing grooves and fourth fixing grooves. The fixture body is provided with an adjustable locating block and a location distance regulation orifice. The fixture body is equipped with a first upper hypotenuse clamping squash and a second upper hypotenuse clamping squash. The multipurpose fixture can fix various ceramic dual-in-line package components, various leadless components and various pin grid array components with different spans; the fixture can meet the clamping and fixing requirements in packaging and bonding without component damage or lead deformation in clamping and fixing.

Description

technical field [0001] The invention relates to a multi-purpose fixture for the workbench of a bonding machine. Specifically, it is assembled on the workbench of the bonding machine and is used for fixing various types of ceramic dual-in-line components with different spans, various lead-free Pin components and pin-grid array components, etc., belong to the field of microelectronic packaging technology. Background technique [0002] At present, various types of ceramic dual-in-line components with different spans, various leadless components and pin-grid array components are usually fixed by vacuum adsorption or compression. In actual use, there are the following problems: 1. Special fixtures for fixed components, different sizes of structural components must be processed and fixed special fixtures, which are replaced with the change of varieties during the bonding process. For example: the clamp for fixing CDIP20 with a span of 7.62mm by vacuum adsorption cannot fix the CD...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/687
Inventor 杨兵黄强张顺亮
Owner WUXI ZHONGWEI GAOKE ELECTRONICS
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