Multipurpose clamper for bonding machine worktable

Abstract

The invention relates to a multipurpose fixture for a bonder worktable, which is characterized in that a fixture body is provided with a chute, in which a slide bar is inserted; a hold-down spring is sheathed into the slide bar, and a hold-down spring stopper is sheathed into the slide bar; a hold-down spring handle is sheathed into the slide bar and is tightened. According to different types and spans of components, the fixture body is provided with different first fixing grooves, second fixing grooves, third fixing grooves and fourth fixing grooves. The fixture body is provided with an adjustable locating block and a location distance regulation orifice. The fixture body is equipped with a first upper hypotenuse clamping squash and a second upper hypotenuse clamping squash. The multipurpose fixture can fix various ceramic dual-in-line package components, various leadless components and various pin grid array components with different spans; the fixture can meet the clamping and fixing requirements in packaging and bonding without component damage or lead deformation in clamping and fixing.

Description

technical field [0001] The invention relates to a multi-purpose fixture for the workbench of a bonding machine. Specifically, it is assembled on the workbench of the bonding machine and is used for fixing various types of ceramic dual-in-line components with different spans, various lead-free Pin components and pin-grid array components, etc., belong to the field of microelectronic packaging technology. Background technique [0002] At present, various types of ceramic dual-in-line components with different spans, various leadless components and pin-grid array components are usually fixed by vacuum adsorption or compression. In actual use, there are the following problems: 1. Special fixtures for fixed components, different sizes of structural components must be processed and fixed special fixtures, which are replaced with the change of varieties during the bonding process. For example: the clamp for fixing CDIP20 with a span of 7.62mm by vacuum adsorption cannot fix the CD...

AI Technical Summary

Problems solved by technology

In actual use, there are the following problems: 1. Special fixtures for fixed components, structural components of different sizes must be processed and fixed special fixtures, and the bonding process is replaced with the change of varieties

For example: the clamp for fixing CDIP20 with a span of 7.62mm by vacuum adsorption cannot fix the CDIP20 with a span of 15.24mm; the clamp for fixing CDIP by vacuum adsorption cannot fix pin-grid array components; The device fixture cannot fix CDIP series, pin grid array, etc.

2. Insufficient clamping strength, especially when the flatness of the fixing surface of the component to be fixed is poor, rough, etc., there will be vacuum leakage, resulting in small adsorption force, weak fixation and poor bonding of the device or even failure

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