Device for debugging circuit board, and method for debugging circuit board

Abstract

The invention discloses a circuit board debugging device and method, comprising a fixed needle socket and an active needle socket, where the fixed pin socket is in the bottom layer and welded to a printed circuit board (PCB), and the active needle socket is plugged in the fixed needle socket and provided with extractable needles, and the jacks on the extractable needles are used for DIP integrated circuit (IC) chips to be inserted in. As measuring, the pins of the extractable needles are suspended and do no contact with the fixed needle socket so that the circuit is cut-off; therefore the invention has no destruction to IC chips and PCBs, thus improving the circuit board debugging effect. And it can accurately locate failures and besides, the suspended pins are easy for fixing the probes of oscillographs and logic analyzers, beneficial to measurement.

Description

technical field [0001] The invention relates to a circuit board debugging device, in particular to a circuit board debugging device using dual in-line packaged chips and a circuit board debugging method. Background technique [0002] At present, there are many circuit boards in various electronic equipment and devices to complete various functions and tasks, and various integrated circuit chips play a decisive role on the circuit boards. Integrated circuit chips come in a variety of packages, such as dual in-line package (DIP), plastic quad flat package (PQFP), pin grid array package (PGA), ball grid array package (BGA), etc. . Among them, the vast majority of small and medium-sized integrated circuits (ICs) are in the form of dual in-line packages (DIP), such as 8088, RAM, FIFO and other devices in Intel series CPUs. [0003] When debugging the entire circuit board, the circuit traces and component pins on the circuit board can be measured and analyzed by an oscilloscope ...

AI Technical Summary

Problems solved by technology

Secondly, whether it is secant line or flying line operation, it is very difficult to operate the densely distributed and narrowly spaced circuit traces on the printed circuit board, and it is very easy to cause undesired short circuits and open circuits that are difficult to find. It brings side effects that cannot be ignored; moreover, for multi-layer PCB boards with internal wiring, the operation of secant and flying lines cannot be implemented at all

Also, such an operation cannot be repeated many times

In addition, secant lines and flying lines also greatly increase the unreliability of printed circuit boards, so boards still need to be re-made after debugging

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