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67results about How to "Prevent electrostatic breakdown" patented technology

Isolated rapid turn-off metal oxide field effect transistor (MOFET) driving circuit

The invention discloses an isolated rapid turn-off metal oxide field effect transistor (MOFET) driving circuit, which comprises a totem-pole output circuit, a transformer T, a negative voltage generation circuit and an MOSFET, wherein an output point of the totem-pole output circuit is connected with the primary dotted terminal of the transformer T through the anode of a blocking capacitor C1; the secondary dotted terminal of the transformer T is sequentially connected in series with a secondary capacitor C2, a diode D4, an electrolytic capacitor C3, a resistor R1 and the MOSFET, and then is connected to the secondary unlike terminal of the transformer T; a voltage stabilizing diode D3 is connected to the two ends of the secondary side of the transformer T; the base of a triode Tr3 is connected with the anode of the secondary capacitor C2, the collector of the triode Tr3 is connected with the cathode of the diode D4, and the emitter of the triode Tr3 is connected with the secondary unlike terminal of the transformer T; a diode D6 is reversely connected in parallel with the two ends of the gate input resistor R1; a voltage stabilizing diode D5 is connected in parallel with the two ends of the electrolytic capacitor C3; and a resistor R2 is connected between the gate and source of the MOSFET. The circuit is applied to places with high requirements on the anti-interference capability of the driving circuit and on rapid turn-off and with large duty ratio variation ranges.
Owner:JIANGSU UNIV

Manufacturing method of X-ray flat panel detector

The invention discloses a manufacturing method of an X-ray flat panel detector. The method comprises the following steps: providing a substrate; forming a thin film transistor, a bottom electrode and a conductive element on the substrate, wherein the bottom electrode and the conductive element are electrically connected as a whole through a connecting part; forming a photoelectric conversion element and a top electrode on the bottom electrode; and forming a shading layer above a channel of the thin film transistor and etching the connecting part to disconnect the bottom electrode and the conductive element. According to the method, the bottom electrode (the source) and the conductive element are electrically connected as a whole through the connecting part, and when manufacture of the thin film transistor is completed, static electricity produced by the bottom electrode (the source) is released through the conductive element at the moment when a supporting column contacts or is separated from the bottom surface of the substrate in the subsequent manufacturing process so as to avoid electrostatic breakdown of the thin film transistor.
Owner:SHANGHAI TIANMA MICRO ELECTRONICS CO LTD

Multifunctional device having vibration function and sound producing function

The invention discloses a multifunctional device having a vibration function and a sound producing function. The multifunctional device comprises a peripheral shell, a vibration system, a magnetic circuit system and an elastic support piece, the magnetic circuit system is supported and fixed through the elastic support piece and is suspended inside the peripheral shell, the vibration system comprises a vibrating diaphragm and a voice coil, the peripheral shell is of metal material, an inner side of the peripheral shell is fixedly provided with a conduction piece, a lead of the voice coil is electrically connected with the conduction piece, the conduction piece is electrically connected with an electrical connecting piece extending to an outer side of the peripheral shell, the electrical connecting piece is conducted with an external circuit, an edge position of the peripheral shell is provided with an injection molding piece of a plastic material which is formed through integral injection molding, the electrical connecting piece is fixed through the injection molding piece, and the injection molding piece does not exceed lateral space of the peripheral shell in a horizontal direction. The multifunctional device provided by the invention can solve in a target manner the problem that adoption of a shell of a metal material easily causes static breakdown, guarantees realization of conduction of internal and external circuits, saves occupied assembling space inside the shell, and improves product performance.
Owner:GOERTEK INC

Substrate liquid processing apparatus and substrate liquid processing method

The present invention provides a substrate liquid processing apparatus and a substrate liquid processing method. It is possible to prevent the occurrence of the electrostatic breakdown caused by the discharge of electric charges in a substrate. According to the invention, in the substrate liquid processing apparatus (1), a substrate liquid processing method, and a computer readable storage medium (48) having a substrate liquid processing program stored therein for performing liquid treatment to the substrate (2), prior to processing a circuit-forming surface of the substrate (2) with a chemical liquid, the substrate liquid processing apparatus performs an anti-static process for an surface opposite to the circuit-forming surface of the substrate (2) by an anti-static liquid, thereby emitting the electric charges on the substrate (2).
Owner:TOKYO ELECTRON LTD

Antenna, antenna unit thereof and wireless communication device equipped with antenna

The invention provides an antenna, an antenna unit thereof and a wireless communication device equipped with the antenna. The antenna unit comprises a first antenna part which comprises a feeding point and a second feeding point part which comprises at least one earth point, wherein the first antenna part and the second antenna part are mutually separated; the second antenna part at least partially surrounds the first antenna part and a part of the first antenna part is intercoupled with a part of the second antenna part to form a first coupling capacitor. The antenna unit provided by the embodiment of the invention leads current of electrostatic discharge to firstly arrive at the second antenna part without arriving at the first antenna part and affecting the chip on the mainboard which is connected with the feeding point of the first antenna part. Besides, the antenna unit provided by the embodiment of the invention not only realizes the radiating function of the antenna together with the mainboard, but also can effectively improve the efficiency of the antenna.
Owner:珠海德百祺科技有限公司

Anti-static device as well as production method and substrate thereof

The invention discloses an anti-static device as well as a production method and a substrate thereof. The anti-static device comprises a first conducting layer, a first insulating layer, an active layer, an etch-resisting layer, and a second conducting layer, wherein the first insulating layer is formed on the first conducting layer; the active layer is formed on the first insulating layer; the etch-resisting layer is formed on the active layer; the second conducting layer is formed on the etch-resisting layer, and comprises a first part and a second part which are spaced from each other; the first part and the second part of the second conducting layer are electrically connected with the active layer via a first through hole and a second through hole formed in the etch-resisting layer respectively; either the first part or the second part of the second conducting layer is electrically connected with the first conducting layer via a fifth through hole which penetrates the etch-resisting layer and the first insulating layer. As the second conducting layer is electrically connected with the first conducting layer via the independent through hole, the potential difference between the first conducting layer and the second conducting layer can be eliminated promptly, and the phenomenon of electrostatic breakdown in a production process can be avoided effectively.
Owner:BOE TECH GRP CO LTD +1

Laser ignition system with double-security design

The invention discloses a semiconductor laser ignition system with a double security design, which belongs to the field of semiconductor laser ignition systems. The semiconductor laser ignition system comprises a singlechip system, a voltage-controlled current source, a laser, a first optical fiber connector, a second optical fiber connector, a laser detonator joint, a laser detonator, a photoelectric detector, an upper computer, a current-limiting resistor, a current-limiting switch and a normally-closed relay, wherein the singlechip system is connected with the upper computer, the voltage-controlled current source, the current-limiting switch, the normally-closed relay and the photoelectric detector respectively; the current-limiting switch is connected in parallel to two ends of the current-limiting resistor; the normally-closed relay is connected in parallel to two ends of the laser; the laser is connected with the voltage-controlled current source, the current-limiting resistor, the current-limiting switch and the first optical fiber connector respectively; the photoelectric detector is connected with the second optical fiber connector; and the laser detonator joint is connected with the laser detonator. In a security mode, static electricity is prevented from puncturing the laser. In a detection mode, the detection light power output by the laser is kept in a safe range. In an ignition mode, the laser can work in a rated state.
Owner:CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI

Optical proximity correction method and mask making method

An optical proximity correction method and a mask making method are provided. The optical proximity correction method includes: providing an initial photolithographic mask pattern including a plurality of main patterns; obtaining a main graphic group from a plurality of main graphics based on an electrostatic prone judgement rule, wherein the main graphic group comprises at least two adjacent maingraphics; setting auxiliary graphics between adjacent main graphics in the main graphics group, wherein the auxiliary graphics includes auxiliary main graphics and auxiliary connecting graphics on both sides of the auxiliary main graphics, and the auxiliary connecting graphics connect the auxiliary main graphics and the main graphics; performing OPC correction on the plurality of main graphics and auxiliary graphics to form main correction graphics from the main graphics and auxiliary correction graphics from the auxiliary graphics, wherein the auxiliary correction graphics comprise auxiliarycorrection main graphics corresponding to the auxiliary main graphics and auxiliary correction connection graphics corresponding to the auxiliary connection graphics. The optical proximity correctionmethod avoids the occurrence of graphic missing angles or bridging damage at opposite cusps of adjacent main correction graphics.
Owner:HUAIAN IMAGING DEVICE MFGR CORP

Manufacturing method of array substrate and array substrate

The invention provides a manufacturing method of an array substrate and the array substrate. The method includes the steps of conducting primary etching on a metal thin film through an etching technology by means of a first mask figure, and conducting secondary etching on the metal thin film through the etching technology by means of a second mask figure to form a metal figure, wherein the width of the second mask figure is smaller than that of the first mask figure. By means of the method, the shielding effect of the mask figure on etching liquid can be reduced, the slope angle of the metal figure can be reduced, the thickness of an insulating layer depositing on the edge position of the metal figure can be increased in the subsequent manufacturing process of the array substrate, the electrostatic breakdown generated on the edge position of the metal figure is avoided, and the yield of the array substrate is increased, and the manufacturing method of the array substrate is simple in process, low in cost and short in manufacturing time.
Owner:HEFEI XINSHENG OPTOELECTRONICS TECH CO LTD +1

Chip support for protecting chip from breakdown by static electricity

A wafer holder includes a mounting plate for mounting a wafer and having a plurality of fluid holes, a decompressor for absorbing the wafer toward the mounting plate while sucking air between the mounting plate and the wafer through the fluid holes, and a liquid supply unit for supplying a liquid toward the wafer to release the wafer from the wafer holder. The liquid has a specific resistance lower than the specific resistance of water.
Owner:NEC ELECTRONICS CORP

Display device

The present invention prevents electrostatic breakdown attributed to static electricity even in and after a cell cutting step. In a display device which includes a substrate, a plurality of pixels which is formed in a pixel part, a plurality of video lines which applies video voltages to the plurality of pixels, and a video voltage selection circuit which selects the video voltages to be inputted to the pixels and applies the selected video voltages to the predetermined video lines among the plurality of video lines, an electrostatic protective circuit for protecting a pixel part is connected to the plurality of video voltage inputting lines which inputs the video voltages to the video voltage selection circuit, and an electrostatic protective circuit for protecting a peripheral circuit is connected to the lines other than the video voltage inputting lines which is connected to the video voltage selection circuit. The electrostatic protective circuit for protecting the pixel part is connected between the plurality of video voltage inputting lines, and the electrostatic protective circuit for protecting the peripheral circuit is connected between the at least one video voltage inputting line and the line other than the at least one video voltage inputting line, between the plurality of lines other than the video voltage inputting lines, and between the line other than the at least one video voltage inputting line and a reference voltage line to which a reference voltage is applied.
Owner:PANASONIC LIQUID CRYSTAL DISPLAY CO LTD +1

Silicon controlled rectifier used for ESD protection

The invention discloses a silicon controlled rectifier used for ESD protection. The silicon controlled rectifier includes a pull-up silicon controlled rectifier, a pull-down silicon controlled rectifier, an isolation resistor, a NMOS transistor and a PMOS transistor. The pull-up silicon controlled rectifier comprises a first N well, which consists of a first P+ implanted region and a first N+ implanted region, and a first P well, which consists of a second P+ implanted region and a second N+ implanted region. The pull-down silicon controlled rectifier comprises a second N well, which consists of a third P+ implanted region and a third N+ implanted region, and a second P well, which consists of a fourth P+ implanted region and a fourth N+ implanted region. In the invention, a voltage clamp structure is formed through a PN diode structure and a well resistance structure which are parasitic on the silicon controlled rectifier; fast response of an ESD pulse and preopening of a protective structure can be achieved. By using the invention, opening speed is fast, weak gate oxide layer can be protected from instant and quick ESD static shock.
Owner:ZHEJIANG UNIV

Real-time fluorescent quantitative PCR (polymerase chain reaction) gene amplification detector

The invention relates to a real-time fluorescent quantitative PCR (polymerase chain reaction) gene amplification detector, characterized by comprising a bottom shell and a gene amplification module disposed in the bottom shell; the gene amplification module comprises an insulating metal plate in 'A' shape and a heating plate arranged at the top of the insulating metal plate, a holding barrel with the top sealed and the bottom opened is arranged on the heating plate, a recessed inverted-cone-shaped reagent hole is arranged in the sealed end of the holding barrel, a fluorescent detection module is releasably arranged above the gene amplification module and comprises a flip bottom plate and a cover arranged on the flip bottom plate, the flip bottom plate is provided with a through hole, a transparent glass plate is arranged in the through hole, a rotary drive is fixed to the top of the flip bottom plate through a fixing support, the output end of the rotary drive is connected to a cylinder below, spacing is reserved between the bottom of the cylinder and the flip bottom plate, and the cylinder follows when the rotary drive rotates.
Owner:滨江华康(北京)生物科技有限公司

Array substrate, manufacturing method thereof, display panel and display device

The invention relates to the field of displaying, and provides an array substrate, a manufacturing method thereof, a display panel and a display device. The manufacturing method of the array substratecomprises the steps of supplying the array substrate which is provided with a pixel region and a fan-out region; forming a first wiring region, a second wiring region and a suspended region between the first wiring region and the second wiring region in the fan-out region, and connecting the fan-out region with the pixel region; forming a film virtual metal wire in the suspended region; and patterning the film virtual metal wire. Through patterning the film virtual metal wire, accumulated static charges are reduced for preventing static breakdown; and on the other hand, Rubbing Mura in friction orientation of an alignment film is prevented, thereby improving product performance. Furthermore simple operation is realized in removing the film virtual metal wire according to the method. The number of processing procedures of the array substrate and manufacturing cost are reduced.
Owner:BOE TECH GRP CO LTD +1

Display Device

The present invention prevents electrostatic breakdown attributed to static electricity even in and after a cell cutting step. In a display device which includes a substrate, a plurality of pixels which is formed in a pixel part, a plurality of video lines which applies video voltages to the plurality of pixels, and a video voltage selection circuit which selects the video voltages to be inputted to the pixels and applies the selected video voltages to the predetermined video lines among the plurality of video lines, an electrostatic protective circuit for protecting a pixel part is connected to the plurality of video voltage inputting lines which inputs the video voltages to the video voltage selection circuit, and an electrostatic protective circuit for protecting a peripheral circuit is connected to the lines other than the video voltage inputting lines which is connected to the video voltage selection circuit. The electrostatic protective circuit for protecting the pixel part is connected between the plurality of video voltage inputting lines, and the electrostatic protective circuit for protecting the peripheral circuit is connected between the at least one video voltage inputting line and the line other than the at least one video voltage inputting line, between the plurality of lines other than the video voltage inputting lines, and between the line other than the at least one video voltage inputting line and a reference voltage line to which a reference voltage is applied.
Owner:PANASONIC LIQUID CRYSTAL DISPLAY CO LTD +1

Array substrate and display device

The invention provides an array substrate. The array substrate comprises a first signal line and a second signal line which are arranged on different insulated and spaced layers of a substrate; one end of the first signal line comprises a first conductive part; one end of the second signal line comprises a second conductive part; the first conductive part and the second conductive part are electrically connected through a connecting structure; and the orthographic projections of an area where the first conductive part is located and an area where the second conductive part is located, on the substrate, are at least partially overlapped. Correspondingly, the invention further provides a display device. According to the array substrate, the disconnection between the signal lines can be reduced, so that the effect of connection between different signal lines can be improved.
Owner:BOE TECH GRP CO LTD +1

Touch display panel and touch display device

The invention provides a touch display panel and a touch display device. The touch display panel comprises a touch panel and a display panel, the touch panel comprises a touch area and a non-touch area. A plurality of parallel touch electrodes are arranged in the touch area, a signal line connected with the touch electrodes and at least two GND routing lines are arranged in the non-touch area, theGND routing lines are arranged in the peripheral area of the signal line, and the GND routing lines are electrically connected with the grounding end of an external driving circuit. According to thetouch panel, the electrostatic discharge problem of the touch panel can be solved, and the influence of static electricity on the internal signal lines and the touch electrodes connected with the signal lines is reduced.
Owner:KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD

Chip chuck

The invention relates to a chip chuck which comprises a base and a chip bracket positioned on the surface of the base, wherein the section of the top end part of the chip bracket forms a shape with a narrow upper part and a wide lower part; when a target chip is not arranged on the chip chuck, the width of the upper edge of the top end part is less than the distance between two rows of pins of thetarget chip, and the width of the lower edge is larger than the distance between two rows of pins of the target chip; the height of the top end part is less than the length of the pins of the targetchip; and the base and the chip bracket are made of conductive materials and are both grounded. The invention has the advantages that the provided chip chuck can conveniently earth the pins of the chip fast, avoids electrostatic breakdown and meets the requirement of large-scale production to efficiency.
Owner:SEMICON MFG INT (SHANGHAI) CORP

Chip chuck

The invention relates to a chip chuck which comprises a base and a chip bracket positioned on the surface of the base, wherein the section of the top end part of the chip bracket forms a shape with a narrow upper part and a wide lower part; when a target chip is not arranged on the chip chuck, the width of the upper edge of the top end part is less than the distance between two rows of pins of the target chip, and the width of the lower edge is larger than the distance between two rows of pins of the target chip; the height of the top end part is less than the length of the pins of the target chip; and the base and the chip bracket are made of conductive materials and are both grounded. The invention has the advantages that the provided chip chuck can conveniently earth the pins of the chip fast, avoids electrostatic breakdown and meets the requirement of large-scale production to efficiency.
Owner:SEMICON MFG INT (SHANGHAI) CORP

Semiconductor integrated circuit device

Disclosed is a semiconductor IC device capable of suppressing the interference of noise generated in one functional block with other functional blocks therein while protecting against electrostatic breakdown. A plurality of isolated pads are connected to a first terminal through respective wires, and further connected to a plurality of isolated pads each connected to a second terminal having the same function as that of the first terminal, so as to reduce noise interference based on the pad isolation and protect against electrostatic breakdown based on the inter-pad connection.
Owner:PANASONIC SEMICON SOLUTIONS CO LTD

Array substrate, manufacturing method thereof and display panel

The invention discloses an array substrate, a manufacturing method thereof and a display panel, and belongs to the technical field of displaying. The array substrate comprises a substrate body; the substrate body is provided with a conduction structure, and the conduction structure comprises overlapped grid lines and data lines; the conduction structure is provided with an insulating structure; apublic electrode layer is formed on the insulating structure; first sunken structures right facing the grid lines and second sunken structures right facing the data lines are arranged at the portion,in a non-display area of the substrate body, in the insulating structure, openings of the first sunken structures and the second sunken structures are all away from the substrate body, and the distance between the bottom faces of the first sunken structures and the grid lines is equal to the distance between the bottom faces of the second sunken structures and the data lines. By means of the arraysubstrate, the manufacturing method thereof and the display panel, the problem that a second capacitor is easily subjected to electrostatic breakdown when there are many electrostatic charges accumulated in the second capacitor is solved, and the manufacturing method of the array substrate and the display panel are used for the array substrate.
Owner:BOE TECH GRP CO LTD +1

Decorative strip

The invention provides a decorative strip. The decorative strip comprises a rectangular frame-shaped enclosing strip, wherein a fastener connected with a panel is arranged at the bottom of the frame-shaped enclosing strip; a copper-coated layer is arranged on the frame-shaped enclosing strip; and a closed annular anti-creeping coating that wraps the copper-coated layer is arranged at the periphery of the copper-coated layer. The rectangular frame-shaped enclosing strip is a body of the decorative strip; the copper-coated layer on the strip is conductive; and the anti-creeping coating is arranged at the periphery of the copper-coated layer, and the anti-creeping coating is an insulation body and is not easy to break down, so that an electronic component near the installation position of the decorative strip can be prevented from being broken down and a protective effect can be achieved. The decorative strip capable of preventing the electronic component from being broken down due to a conductive metal coating is provided.
Owner:CHONGQING RUIYANG TECH DEV

Array substrate, manufacturing method of array substrate, display panel and display device

The invention relates to an array substrate, a manufacturing method of the array substrate, a display panel and a display device. The array substrate comprises a substrate, first leads, a first insulation layer, second leads and a connection part, wherein the first leads are positioned on the substrate; the first insulation layer is positioned on the first leads; the second leads are positioned on the first insulation layer; at least parts of projections of the first leads and the second leads on the substrate are overlapped; at least one of the first leads and the second leads consists of conductive segments which are arranged at intervals; and the connection part is used for electrically connecting adjacent conductive segments of the first leads or the second leads.
Owner:BOE TECH GRP CO LTD +1

Clamp for mounting a plurality of laser chips

The invention discloses a clamp for mounting a plurality of laser chips. The clamp comprises a substrate and a spring block, a through hole is formed in the surface of the substrate, and an optical positioning point a is arranged above the right side of the top surface of the substrate. An optical positioning point b is arranged below the right side of the top surface of the substrate, and the optical positioning point a and the optical positioning point b are both L-shaped structures. A limiting block a is arranged above the left side of the through hole, a rubber layer is arranged at the bottom end of the limiting block a, and the rubber layer is made of anti-static rubber. A chamfer is arranged at the right side of the rubber layer, and through the chamfer, the surface of the chip can be prevented from being abraded during the chip clamping process. A limiting block b is arranged at the right side of the limiting block a, a spring block is arranged in the middle at the bottom end ofthe through hole, and the limiting block a, the limiting block b and the spring block are all fixed to the back of the substrate. A protruding block is arranged above the interior of the spring blockand can move up and down in the spring block, and a spring is arranged at the bottom end of the protruding block. The clamp has the advantages of being capable of clamping a plurality of chips, and being accurate in positioning and firm in clamping.
Owner:湖南红鑫通信技术有限责任公司

Semiconductor photoresist cleaning agent

The invention relates to a semiconductor photoresist cleaning agent, which comprises alcohol amine, C4-C6 polyol, a solvent, organic base, and an additive. All the components are mixed to form a mixedsolution. Then, a semiconductor wafer containing the photoresist is immersed in the mixed solution, heated to 85 degrees centigrade, immersed for a set period of time, taken out, and dried with high-purity nitrogen. During the photoresist removal process, a resin material in the photoresist is dissolved or decomposed in the mixed solution after the semiconductor wafer containing the photoresist is immersed in the mixed solution, so that a purpose of removing the residual photoresist on the surface of the semiconductor wafer is achieved. At the same time, a conductive layer with a thickness of1.2 [mu]m is formed on the surface of the semiconductor wafer immersed in the mixed solution and has an ability to limit the current and protect electrodes and circuits, thereby achieving functions of preventing a chip surface circuit on a circuit board from being oxidized, and avoiding electrostatic breakdown of the circuit and chipping the edge of the chip.
Owner:深圳市伯斯特科技有限公司

Wired circuit board having a semiconductive grounding layer and producing method thereof

A wired circuit board includes a metal supporting board, an insulating layer formed on the metal supporting board, a conductive pattern formed on the insulating layer and having a plurality of wires, and a semiconductive layer formed on a surface of the insulating layer exposed from the conductive pattern so as to be in contact with the conductive pattern. The insulating layer is formed with a groove exposing the metal supporting board between at least two adjacent wires, and the semiconductive layer is in contact with the metal supporting board in the groove.
Owner:NITTO DENKO CORP

Anti-static structure of touch screen

The invention discloses an anti-static structure of a touch screen, which comprises a protective cover plate. The bottom of the protective cover plate is fixedly connected with an upper anti-static matching plate. A grounding groove is etched in the part, in contact with the protective cover plate, of the upper anti-static matching plate. A cathode conducting layer, an isolation layer and an anodeconducting layer are sequentially connected into the groove of the upper anti-static matching plate from top to bottom, and a liquid crystal display layer is connected to the bottom of the lower anti-static matching plate. Conductive adhesives are coated in the grounding grooves of the upper anti-static matching plate and the lower anti-static matching plate; a plurality of grounding wire slots are uniformly formed in the edges of the upper anti-static matching plate and the lower anti-static matching plate; according to the invention, the anti-static matching plates are arranged above the cathode conducting layer and below the anode conducting layer. The two-way electrostatic breakdown phenomenon is effectively prevented. The thickness of the electrostatic layer is reduced through the grounding groove type design. Meanwhile, the upper anti-static matching plate and the lower anti-static matching plate protect the conductive layer while static electricity is effectively guided out. The functions are diversified.
Owner:ANHUI BENGBU HUAYI CONDUCTIVE FILM GLASS

Substrate liquid processing device and substrate liquid processing method

The invention provides a substrate liquid processing device and a substrate liquid processing method. Prevents electrostatic breakdown due to the discharge of charges carried by the substrate. In the present invention, in the substrate liquid processing device (1), the substrate liquid processing method, and the computer-readable recording medium (48) recording the substrate liquid processing program for performing liquid processing on the substrate (2), in Before the liquid treatment step of liquid-treating the circuit-forming surface of the substrate (2) with a substrate-treating liquid, a static-elimination treatment step is performed, in which the circuit-forming surface of the substrate (2) is formed using a static-elimination treatment liquid. The surface opposite to the surface is treated, thereby releasing the charges carried by the substrate (2).
Owner:TOKYO ELECTRON LTD
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