This invention provides a pin
cutting device for testing
integrated circuit boards, relating to the field of
integrated circuit boards. The device includes a contact sleeve, an extension tube threaded onto the surface of the contact sleeve, a guide ring fixedly connected to the upper end of the extension tube, a broken track ring fixedly connected to the upper end of the guide ring, a rotating ring rotatably connected to the outer side of the broken track ring, a force plate slidably connected to the inner groove of the broken track ring, a limit block fixedly connected to the end of the force plate furthest from each other, the limit block slidably connected to the broken track ring, and a compression spring fixedly connected to the side of the limit block furthest from each other. This pin
cutting device for testing
integrated circuit boards prevents
electrostatic discharge (ESD) from damaging the circuit board by directly contacting the circuit board with the contact sleeve, and controls the pin length through the extension tube, ensuring uniform pin lengths on the circuit board, thus preventing ESD from the contact and solving the problems of inconsistent pin lengths and ESD damage to the integrated circuit board during
cutting.