67results about How to "Prevent electrostatic breakdown" patented technology

The invention discloses an anti-static device as well as a production method and a substrate thereof. The anti-static device comprises a first conducting layer, a first insulating layer, an active layer, an etch-resisting layer, and a second conducting layer, wherein the first insulating layer is formed on the first conducting layer; the active layer is formed on the first insulating layer; the etch-resisting layer is formed on the active layer; the second conducting layer is formed on the etch-resisting layer, and comprises a first part and a second part which are spaced from each other; the first part and the second part of the second conducting layer are electrically connected with the active layer via a first through hole and a second through hole formed in the etch-resisting layer respectively; either the first part or the second part of the second conducting layer is electrically connected with the first conducting layer via a fifth through hole which penetrates the etch-resisting layer and the first insulating layer. As the second conducting layer is electrically connected with the first conducting layer via the independent through hole, the potential difference between the first conducting layer and the second conducting layer can be eliminated promptly, and the phenomenon of electrostatic breakdown in a production process can be avoided effectively.

The present invention prevents electrostatic breakdown attributed to static electricity even in and after a cell cutting step. In a display device which includes a substrate, a plurality of pixels which is formed in a pixel part, a plurality of video lines which applies video voltages to the plurality of pixels, and a video voltage selection circuit which selects the video voltages to be inputted to the pixels and applies the selected video voltages to the predetermined video lines among the plurality of video lines, an electrostatic protective circuit for protecting a pixel part is connected to the plurality of video voltage inputting lines which inputs the video voltages to the video voltage selection circuit, and an electrostatic protective circuit for protecting a peripheral circuit is connected to the lines other than the video voltage inputting lines which is connected to the video voltage selection circuit. The electrostatic protective circuit for protecting the pixel part is connected between the plurality of video voltage inputting lines, and the electrostatic protective circuit for protecting the peripheral circuit is connected between the at least one video voltage inputting line and the line other than the at least one video voltage inputting line, between the plurality of lines other than the video voltage inputting lines, and between the line other than the at least one video voltage inputting line and a reference voltage line to which a reference voltage is applied.

A multiple circuit board includes a board having a plurality of product regions respectively corresponding to a plurality of array boards and an out-of-product region, out-of-product wires provided in the out-of-product region, waveform wires electrically connected to the out-of-product wires and extending to depict waveforms to alternately pass inside and outside of the respective product regions, circuit elements provided in respective display regions of the plurality of product regions, scanning circuits provided adjacent to the respective display regions of the plurality of product regions, and a plurality of scanning lines extending from the scanning circuits to both sides in each of the product regions and connecting to the circuit elements at one side and connecting to the waveform wires inside the product region at the other side.

A wired circuit board includes a metal supporting board, an insulating layer formed on the metal supporting board, a conductive pattern formed on the insulating layer and having a plurality of wires, and a semiconductive layer formed on a surface of the insulating layer exposed from the conductive pattern so as to be in contact with the conductive pattern. The insulating layer is formed with a groove exposing the metal supporting board between at least two adjacent wires, and the semiconductive layer is in contact with the metal supporting board in the groove.

The invention discloses an adjustment base for clamping a PCB. The adjustment base comprises a window-type frame and the PCB clamped in the window-type frame. The inner-side wall of the window-type frame is provided with grooves, the two ends of the PCB are respectively arranged in the grooves at the left-side wall and the right-side wall of the window-type frame; the window-type frame comprises a sleeve whose openings at two sides are of cavity structures, a dead lever arranged in the inner cavity of the sleeve and slide bars respectively connected with the fixed lever through an elastic member; the window-type frame is provided with a wrapping post; and the elastic member comprises a connecting rod whose opening at one end is of a cavity structure, an adjustment rod slidably arranged in the connecting rod and a spring connecting the adjustment rod with the connecting rod, and the adjustment rod is sleeved by the spring. According to the invention, the adjustment rod is sleeved by the spring to enable the spring to extend only along the axial direction of the adjustment rod so as to limit the spring and prevent the spring from deformation due to stretching.

The invention provides a substrate liquid processing device and a substrate liquid processing method. Prevents electrostatic breakdown due to the discharge of charges carried by the substrate. In the present invention, in the substrate liquid processing device (1), the substrate liquid processing method, and the computer-readable recording medium (48) recording the substrate liquid processing program for performing liquid processing on the substrate (2), in Before the liquid treatment step of liquid-treating the circuit-forming surface of the substrate (2) with a substrate-treating liquid, a static-elimination treatment step is performed, in which the circuit-forming surface of the substrate (2) is formed using a static-elimination treatment liquid. The surface opposite to the surface is treated, thereby releasing the charges carried by the substrate (2).