Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Clamp for mounting a plurality of laser chips

A chip mounting and laser technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems affecting the accuracy and quality of placement, inaccurate equipment positioning, and anti-soldering offset, etc., to improve accuracy and Quality, prevent reference position deviation, and facilitate clamping effect

Inactive Publication Date: 2020-03-17
湖南红鑫通信技术有限责任公司
View PDF0 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Existing optical positioning points generally adopt a circular appearance, and the size of the circle is determined by the size of the solder resist ink. In this design, there will be a problem of solder mask offset, which will lead to inaccurate positioning of the equipment, thereby affecting the accuracy of the placement and Quality, during the placement process, if the fixture is clamped too tightly, the chip will be broken due to uneven force, and it is easy to cause damage to the chip during the clamping process, so a multi-laser chip placement method is needed fixture

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Clamp for mounting a plurality of laser chips
  • Clamp for mounting a plurality of laser chips
  • Clamp for mounting a plurality of laser chips

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] see figure 1 , 2 , a fixture for mounting multiple laser chips, the surface of the substrate 1 is provided with a through hole 2, and the upper right side of the top surface of the substrate 1 is provided with an optical positioning point a3, and the optical positioning point a3 is fixed on the substrate 1 by screws, and the substrate 1 There is an optical positioning point b4 on the lower right side of the top surface, and the optical positioning point b4 is fixed on the base plate 1 by screws. The point a3 and the optical positioning point b4 effectively prevent the offset of the reference position of the optical positioning point due to ink offset, thereby effectively improving the accuracy and quality of the placed part.

Embodiment 2

[0025] see image 3 , 4 , 5, a fixture for mounting multiple laser chips, a limit block a5 is provided on the upper left side of the through hole 2, the limit block a5 is fixed on the substrate 1 by screws, and a rubber layer is provided at the bottom of the limit block a5 9. The rubber layer 9 is made of antistatic rubber, and the right side of the rubber layer 9 is provided with a chamfer 8, and the rubber layer 9 is fixed on the limit block a5 by glue, and the limit block a5 is provided with a limit block b6 on the right side, and the limit block b6 is fixed on the substrate 1 by screws, a spring block 7 is arranged in the middle of the bottom of the through hole 2, and the spring block 7 is fixed on the substrate 1 by screws, and the limit block a5, the limit block b6 and the spring block 7 are all fixed on the substrate 1 The back of the spring block 7 is provided with a bump 10 above the inside, the bump 10 is fixed in the spring block 7 through a sleeve, the bump 10 ca...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a clamp for mounting a plurality of laser chips. The clamp comprises a substrate and a spring block, a through hole is formed in the surface of the substrate, and an optical positioning point a is arranged above the right side of the top surface of the substrate. An optical positioning point b is arranged below the right side of the top surface of the substrate, and the optical positioning point a and the optical positioning point b are both L-shaped structures. A limiting block a is arranged above the left side of the through hole, a rubber layer is arranged at the bottom end of the limiting block a, and the rubber layer is made of anti-static rubber. A chamfer is arranged at the right side of the rubber layer, and through the chamfer, the surface of the chip can be prevented from being abraded during the chip clamping process. A limiting block b is arranged at the right side of the limiting block a, a spring block is arranged in the middle at the bottom end ofthe through hole, and the limiting block a, the limiting block b and the spring block are all fixed to the back of the substrate. A protruding block is arranged above the interior of the spring blockand can move up and down in the spring block, and a spring is arranged at the bottom end of the protruding block. The clamp has the advantages of being capable of clamping a plurality of chips, and being accurate in positioning and firm in clamping.

Description

technical field [0001] The invention relates to the technical field of chip mounting fixtures, in particular to a fixture for mounting multiple laser chip chips. Background technique [0002] With the progress of society and the development of economy, semiconductor lasers are more and more widely used in medical and military fields due to their small size, light weight, and high electro-optical conversion efficiency. With the rapid development of the electronics industry, electronic products are miniaturized The trend is becoming more and more obvious, and it is widely used in various electronic products and large-scale equipment and devices. In order to meet the needs of automatic production and processing, it is necessary to add optical positioning points on the surface and bottom of the mounting board; [0003] Existing optical positioning points generally adopt a circular appearance, and the size of the circle is determined by the size of the solder resist ink. In this ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/67H01L21/68
CPCH01L21/67121H01L21/681
Inventor 李明东
Owner 湖南红鑫通信技术有限责任公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com