Chip chuck

Abstract

The invention relates to a chip chuck which comprises a base and a chip bracket positioned on the surface of the base, wherein the section of the top end part of the chip bracket forms a shape with a narrow upper part and a wide lower part; when a target chip is not arranged on the chip chuck, the width of the upper edge of the top end part is less than the distance between two rows of pins of the target chip, and the width of the lower edge is larger than the distance between two rows of pins of the target chip; the height of the top end part is less than the length of the pins of the target chip; and the base and the chip bracket are made of conductive materials and are both grounded. The invention has the advantages that the provided chip chuck can conveniently earth the pins of the chip fast, avoids electrostatic breakdown and meets the requirement of large-scale production to efficiency.

Description

【Technical field】 [0001] The invention relates to semiconductor packaging technology, in particular to a chip chuck capable of preventing electrostatic breakdown. 【Background technique】 [0002] Wire bonding is an indispensable link in semiconductor packaging technology. The usual wire bonding technology is to place the chip on a wire chuck and use special wire bonding equipment for wire bonding. [0003] attached figure 1 Shown is a top view of a conventional chip chuck, including a base 1 and chip holders 2 , 3 and 4 located on the surface of the base 1 . According to actual needs, more chip trays can also be designed. attached figure 2 shown attached figure 1 The cross-sectional view of the chip chuck along the a-a direction. The sidewalls of chip trays 2, 3 and 4 are vertical, and the width of the chip tray is smaller than the distance between two rows of pins of the target chip, so as to ensure that the chip can be placed on the chip tray smoothly. attached im...

AI Technical Summary

Problems solved by technology

[0004] In this step, the pins of the chip placed on the chip chuck are suspended, so the chip is easily broken down by the static electricity carried by the equipment or the operator, thus affecting the yield of the chip

The method of using wires to ground the pins needs to be connected to the pins of the chip every time a chip is installed. The operation is too cumbersome and inefficient, and it is not suitable for mass production.

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