Chip support for protecting chip from breakdown by static electricity

A technology for wafer holders and wafers, which is applied in the direction of grinding workpiece holders, supports, circuits, etc., and can solve problems such as leakage of electrostatic charges, failure to protect wafers from electrostatic breakdown, etc.

Inactive Publication Date: 2003-03-19
NEC ELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

More particularly, the ionized air used in JP-A-6-123924 and the water used in JP-A-11-289004 have a large specific resistance, so that static charges cannot be leaked and no Can protect the chip against electrostatic breakdown

Method used

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  • Chip support for protecting chip from breakdown by static electricity
  • Chip support for protecting chip from breakdown by static electricity
  • Chip support for protecting chip from breakdown by static electricity

Examples

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Embodiment Construction

[0014] In one embodiment of the invention, the wafer holder is used in a chemical mechanical polishing (CMP) apparatus. The CMP apparatus receives a wafer from a production line through a wafer holder, places the wafer in a grinding head while centering the wafer thereon, and thereby polishes the wafer.

[0015] For the same mount on it, the wafer holder is used to pick up the wafer, and release the wafer from the picked up state by using a liquid.

[0016] In one embodiment of the invention, when a processing robot places the wafer on the mounting plate of the wafer holder, the fluid evacuation member is selectively in communication and operable with the fluid hole to draw air surrounding the wafer holder through the fluid hole, And the wafer is sucked by evacuating air from the fluid evacuation part through the fluid hole.

[0017] The wafer holder then releases the wafer from suction for wafer centering with the CMP equipment. At this stage, the liquid supply unit optiona...

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PUM

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Abstract

A wafer holder includes a mounting plate for mounting a wafer and having a plurality of fluid holes, a decompressor for absorbing the wafer toward the mounting plate while sucking air between the mounting plate and the wafer through the fluid holes, and a liquid supply unit for supplying a liquid toward the wafer to release the wafer from the wafer holder. The liquid has a specific resistance lower than the specific resistance of water.

Description

technical field [0001] The present invention relates to a wafer carrier on which wafers are mounted while protecting the wafer from electrostatic breakdown, and more particularly to a wafer carrier such as is used for transferring wafers from a production line to a processing station such as a polishing apparatus. Background technique [0002] A wafer includes a plurality of semiconductor devices fabricated therein. If a wafer has charges on a main surface on which a semiconductor device having precision components is mounted, the electrostatic force of the charges can damage interconnections formed on the wafer or damage a resist film coated on the wafer. [0003] For example, patent applications JP-A-6-123924 and JP-A-11-289004 describe wafer holders for transferring wafers from a production line to polishing equipment. [0004] In the wafer holder described in JP-A-6-123924, a separation device or release member provides a positive pressure gas between the wafer holder a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23Q3/08B23Q7/04H01L21/304H01L21/68H01L21/683
CPCH01L21/6831B24B41/068B24B37/30H01L21/68
Inventor 笠原正义工藤正道渡部泰则森田朋岳石黑芳朗
Owner NEC ELECTRONICS CORP
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