Substrate liquid processing apparatus and substrate liquid processing method

A technology for liquid processing and substrate processing, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as electrostatic breakdown, and achieve the effect of preventing electrostatic breakdown

Active Publication Date: 2011-05-04
TOKYO ELECTRON LTD
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  • Abstract
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Problems solved by technology

[0004] In addition, when the substrate and structural parts are charged, electrostatic breakdown may occur on the circuit formation surface of the substrate

Method used

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  • Substrate liquid processing apparatus and substrate liquid processing method
  • Substrate liquid processing apparatus and substrate liquid processing method
  • Substrate liquid processing apparatus and substrate liquid processing method

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Embodiment Construction

[0041]The specific structure of the substrate liquid processing apparatus, the substrate liquid processing method used in the substrate liquid processing apparatus, and the substrate liquid processing program for causing the substrate liquid processing apparatus to perform liquid processing on a substrate according to the present invention will be described below with reference to the accompanying drawings. .

[0042] Such as figure 1 As shown, a substrate loading and unloading table 4 is formed at the front end of the substrate liquid processing apparatus 1, and the substrate loading and unloading table 4 collects a plurality of (for example, 25) substrates 2 (here, semiconductor wafers) on a carrier 3 to carry out loading and unloading. , and a substrate transport chamber 5 is formed at the rear of the substrate loading and unloading table 4. The substrate transport chamber 5 is used to transport the substrates 2 accommodated on the carrier 3 piece by piece. The substrate ...

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Abstract

The present invention provides a substrate liquid processing apparatus and a substrate liquid processing method. It is possible to prevent the occurrence of the electrostatic breakdown caused by the discharge of electric charges in a substrate. According to the invention, in the substrate liquid processing apparatus (1), a substrate liquid processing method, and a computer readable storage medium (48) having a substrate liquid processing program stored therein for performing liquid treatment to the substrate (2), prior to processing a circuit-forming surface of the substrate (2) with a chemical liquid, the substrate liquid processing apparatus performs an anti-static process for an surface opposite to the circuit-forming surface of the substrate (2) by an anti-static liquid, thereby emitting the electric charges on the substrate (2).

Description

technical field [0001] The present invention relates to a substrate liquid processing device, a substrate liquid processing method, and a computer-readable recording medium recorded with a substrate liquid processing program for performing liquid processing on a substrate with a processing liquid. Background technique [0002] Conventionally, when manufacturing semiconductor components, flat panel displays, etc., substrates such as semiconductor wafers and liquid crystal substrates are cleaned and etched using processing liquids such as cleaning agents and etchant using substrate liquid processing equipment. [0003] In this substrate liquid processing device, due to various reasons such as charging of the processing liquid and friction of the movable part, the substrate processed by the substrate liquid processing device, components constituting the substrate liquid processing device, etc. may be charged due to static electricity. charge. [0004] In addition, when the sub...

Claims

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Application Information

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IPC IPC(8): H01L21/00H01L21/02
CPCH01L21/02057H01L21/67051
Inventor 田中裕司南辉臣川渕洋介伊藤规宏上村史洋薮田贵士小佐井一树乌野崇关口贤治藤井康
Owner TOKYO ELECTRON LTD
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