Pin trimming device based on recycled DIP (dual in-line package) type IC (integrated circuit) chip

A technology for trimming devices and pins, used in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as easy shaking, affecting the accuracy of trimming, and inability to handle pin bending or skewing, reaching the applicable range. Wide, high precision, the effect of solving the problem of pin trimming

Inactive Publication Date: 2013-01-02
HEFEI UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The publication date is January 28, 2009, and the Chinese patent with the publication number CN201188745 discloses a "pin trimming device". trimming, but it can only solve the problem of coplanarity of component pins, and cannot handle the bending or skewing of pins other than coplanarity, and the device is prone to shaking when the upper template acts on the component, which affects the accuracy of trimming sex

Method used

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  • Pin trimming device based on recycled DIP (dual in-line package) type IC (integrated circuit) chip
  • Pin trimming device based on recycled DIP (dual in-line package) type IC (integrated circuit) chip
  • Pin trimming device based on recycled DIP (dual in-line package) type IC (integrated circuit) chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0037] In the present embodiment, the structure based on the reclaimed DIP package IC chip pin trimming device is set to:

[0038] Such as Figure 4 The pin coplanar trimming unit shown is to form a coplanar trimming die with a concave lower die 11 and an inverted concave upper die 12, and the joint trimming state of the trimming die is: the chip 15 is placed with the pins facing down On the concave lower mold 11 , the inverted concave upper mold 12 is buckled on the chip 15 and clamps the chip 15 with the concave lower mold 11 . The coplanar trimming of the pins of the DIP-packaged IC chip is accomplished by mold clamping between the concave lower mold 11 and the inverted concave upper mold 12 .

[0039] Such as Figure 5 The shown airflow channel 20 of the convex lower mold, the same airflow channel 20 on the concave lower mold 11 and the concave base 11a, the chip 15 is fixed by an external vacuum pump.

[0040] Such as Image 6 The shown pin dedendum trimming unit is b...

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PUM

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Abstract

The invention discloses a pin trimming device based on recycled DIP (dual in-line package) type IC (integrated circuit) chip. The pin trimming device is characterized by comprising a pin coplane trimming unit, a pin tooth root trimming unit, a pin prong trimming unit and a pin finishing unit. Based on the device disclosed by the invention, the DIP type IC chip can be efficiently, accurately, economically and practically recycled through the pin coplane trimming, the pin tooth root trimming, the pin prong trimming and the pin finishing in sequence.

Description

technical field [0001] The invention relates to a device for trimming pins of an integrated circuit IC chip, in particular to a device and method for trimming IC chip pins in DIP packaging for recycling. Background technique [0002] IC chips in DIP package (Dual In-line Package, dual in-line package) are installed through holes, which is very convenient for wiring and welding, and is widely used in the electronics industry. With the advancement of technology and the increase of product service life, more and more electronic products have been eliminated, resulting in a large number of discarded DIP packaged IC chips. After proper treatment, most of these chips can still be used and have high economic value. However, the number of pins of DIP packaged IC chips is large, the pitch is small, and the material is soft. It is inevitable that the pins will be bent or skewed during disassembly, transportation and storage, which will affect subsequent detection and reuse. Therefor...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
Inventor 王玉琳蒋浩宋守许刘志峰刘光复
Owner HEFEI UNIV OF TECH
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