Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Dual in-line package frame

A dual-in-line package and frame technology, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of poor heat dissipation performance, diameter limitation, insufficient thermal conductivity, etc., to improve the heat dissipation effect, increase the vertical area, The effect of reducing the heat transfer distance

Inactive Publication Date: 2014-07-09
ZHUHAI GREE XINYUAN ELECTRONICS +1
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The heat dissipation of this type of packaging depends entirely on the insulation of the die itself, which requires high insulation of the die, and the area of ​​the base island attached to the die is small. The base island mainly serves to uniform the temperature of the die, and the actual heat dissipation poor performance
And the chip and the inner pin are connected by gold wire or aluminum wire, the gold wire or aluminum wire is limited by diameter, and the thermal conductivity is insufficient

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Dual in-line package frame
  • Dual in-line package frame
  • Dual in-line package frame

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] In order to solve the problem of poor heat dissipation, a dual-in-line package frame is proposed to improve the heat dissipation effect.

[0021] The above and other technical features and advantages of the present invention will be described in more detail below in conjunction with the accompanying drawings.

[0022] see figure 1 As shown, it is a schematic cross-sectional view of a frame of a dual in-line package of the present invention. A frame 100 of a dual in-line package of the present invention includes a base island 110 , a chip 120 and inner pins 130 .

[0023] The base island 110 is flat, the inner pins 130 are connected to the base island 110 , and the chip 120 is installed on the base island 110 .

[0024] see figure 2 As shown, it is a schematic left view of the frame of the dual-in-line package of the present invention. There is an angle between the inner pin 130 and the flat surface of the base island 110, and the inner pin 130 forms the angle by bend...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a dual in-line package frame. The dual in-line package frame comprises a base island piece, a chip and an internal pin, wherein the base island piece is in a flat plate shape, the internal pin is connected to the base island piece, and the chip is arranged on the base island piece. An included angle exists between the internal pin and the flat plate face of the base island piece. The internal pin and the base island piece are integrally formed, and the aim of improving the heat dissipation effect is achieved.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a frame used in dual in-line packaging technology. Background technique [0002] In general, semiconductor products in the form of a dual in-line package (DIP) use a flat frame, and the chip is soldered to the bottom metal base island by solder, and the base island is exposed from the bottom of the package for heat dissipation. [0003] The heat dissipation of this type of packaging depends entirely on the insulation of the die itself, which requires high insulation of the die, and the area of ​​the base island attached to the die is small. The base island mainly serves to uniform the temperature of the die, and the actual heat dissipation Performance is poor. Moreover, the chip and the inner pins are connected by gold or aluminum wires, which are limited in diameter and have insufficient thermal conductivity. [0004] In view of the above-mentioned defects, the...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L23/495H01L23/36
CPCH01L2924/181H01L2224/48095H01L2224/48137H01L2224/48139H01L2224/48247H01L2224/4903H01L2924/00012
Inventor 余晋杉沐运华廖伟强
Owner ZHUHAI GREE XINYUAN ELECTRONICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com