Testing clamp for mixing circuit

Abstract

The invention discloses a testing clamp for a mixing circuit, which comprises a metal framework, and is characterized in that the metal framework comprises a front side vertical surface, a rear side vertical surface, a left side vertical surface, a right side vertical surface and a lower bottom surface. A guide rail groove is respectively arranged at the upper ends of the front side vertical surface and the rear side vertical surface, two movable printed circuit boards are arranged on guide rails arranged in the two guide rail grooves and provided with square sockets with two rows of pins, the pins are connected to round-hole sockets on the printed circuit boards close to the left side vertical surface and the right side vertical surface through printed circuits on the welding surface of the printed circuit boards, and the round-hole sockets are connected onto a testing instrument through connecting plugs and connecting leads. The testing clamp can adapt to mixing integrated circuits with various different single-row or double-row in-line package sizes, solves problems of generality and reutilization, and can achieve testing of the mixing integrated circuits with various models, sizes and package forms by utilizing one set of clamp.

Description

technical field [0001] The invention relates to a circuit testing device, in particular to a hybrid integrated circuit testing fixture. Background technique [0002] A hybrid integrated circuit is a reintegration of a monolithic integrated circuit and other components, usually a circuit module or component obtained through secondary development. This characteristic of hybrid integrated circuits determines the diversity of its size and the complexity of testing. At present, most of the packaging forms of hybrid integrated circuits are single-in-line packages or dual-in-line packages. The number of pins of these circuits may be different, the spacing e between the pins in the same column is usually 2.54mm, the span e1 between the pins of two columns of dual in-line package circuits may be different, usually a multiple of e, for example 3e, 4e, 6e, 8e, 9e, 10e, 12e, etc. [0003] In order to perform quality inspection on hybrid integrated circuits, it is necessary to make hyb...

AI Technical Summary

Problems solved by technology

[0004] For the shortcoming of prior art, the object of the present invention is to provide a kind of hybrid circuit test fixture, can adapt to the test fixture of the hybrid integrated circuit of various different single row or double in-line package size, has solved the universality problem of test fixture and The problem of reusable fixtures, using a set of fixtures can realize the test of hybrid integrated circuits of various models, sizes and packaging forms

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