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Design method for canceling PCBA wave soldering process

A design method and wave soldering technology, which is applied in printed circuit manufacturing, electrical components, printed circuits, etc., can solve the problems of product reliability impact and increase the reliability risk of printed circuit boards, so as to eliminate pollution, improve quality and market Competitiveness, the effect of increasing reliability

Inactive Publication Date: 2016-08-24
LANGCHAO ELECTRONIC INFORMATION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

After the printed circuit board goes through the wave soldering process, the surface of the PCBA is somewhat polluted by liquid flux (Flux), which has a serious impact on the reliability of the product, and the printed circuit board undergoes one more heating, increasing The reliability risk of the printed circuit board

Method used

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Examples

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Effect test

Embodiment 1

[0026] The invention proposes a design method for canceling the PCBA wave soldering process. The main idea of ​​this method is: use a single-pin connector with a material temperature resistance higher than 280 degrees that can go through a reflow soldering process, and use a Pin in Paste through-hole process (Pin in Paste) in the surface mount technology process. ) first soldered to the printed circuit board, and then use the plug-in method to insert the parts that are not resistant to high temperature into these single-pin connectors.

[0027] Specific design plan:

[0028] Single pin connector:

[0029] Choose a single-pin connector, one end is a Pin pin, which is used for soldering with the through hole of the printed circuit board, using the Pin InPaste process; the other end is a pin hole, which is used for mechanical connection with the Pin pin of the DIP part.

[0030] Surface mount technology process PIP process:

[0031] According to the pin dipping solder paste th...

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PUM

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Abstract

The invention discloses a design method for canceling a PCBA wave soldering process. The method is characterized by comprising the following specific steps: 1. selecting a single-pin connector; 2. adopting a pin in paste through-hole process, trepanning a through-hole corresponding to a copper mesh and printing the solder paste on the through-hole, mounting the single-pin connector to the through-hole, and completing reflow soldering; and 3. after a printed circuit board is processed through a surface mounting technology process, in a dual in-line package plug-in process, inserting parts into the single-pin connector. Compared with the prior art, the method disclosed by the invention realizes the cancellation of the PCBA wave soldering process, so that the pollution of the liquid flux is completely eradicated, the reliability of the printed circuit board is improved, and the product quality and the market competitiveness are lifted.

Description

technical field [0001] The invention relates to the technical field of PCBA wave soldering, in particular to a design method for canceling the PCBA wave soldering process. Background technique [0002] In modern society, almost every kind of electronic equipment, ranging from small electronic watches and calculators to large computers, communication electronic equipment, and military weapon systems, as long as there are electronic components such as integrated circuits, they must be used for the electrical interconnection between them. PCB. In the research process of larger electronic products, the design and manufacturing quality of printed boards directly affect the quality and cost of the entire product, and even lead to the success or failure of commercial competition. Optimizing the production process and process of PCBA, reducing the quality risk of printed circuit boards, and reducing costs will become an eternal topic. [0003] PCB (Printed Circuit Board), the Chin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34
CPCH05K3/3494H05K2203/043
Inventor 姚翼文
Owner LANGCHAO ELECTRONIC INFORMATION IND CO LTD
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