Dual in-line package (DIP) LED (Light Emitting Diode) automatic forming device capable of positioning height and DIP LED automatic forming method
An automatic molding and in-line technology, applied in the electronic field, can solve the problems of LED body resin cracking, special materials, not suitable for multi-model and small batch production, etc., and achieve the effect of convenient mechanical automatic bonding and pressing
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[0030] The specific embodiments of the present invention will be further described below in conjunction with the accompanying drawings.
[0031] Such as figure 1 and 2 As shown, the in-line LED of the present invention includes an in-line LED body 1 and insulating height positioning adhesive strips bonded to two pins 11 of the in-line LED body 1, and the bottom surfaces of all height positioning adhesive strips are plane, and the bottom surfaces of all height positioning strips are on the same horizontal plane 13 perpendicular to the pins. Here, the connection position of the highly positioned rubber strip only needs to enable the in-line LED body to be supported on the PCB under the action of the automatic plug-in device. In this embodiment, the cross section of the height positioning rubber strip is square.
[0032] In order to simplify the molding process, such as figure 2 The shown embodiment adopts two height positioning strips 21a, 22a, the height positioning strip ...
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